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Intel 6300ESB ICH, Xeon user manual Heatsink Assembly, Components Requiring Heat Sink Assembly

Models: 6300ESB ICH Xeon

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	Heatsink Assembly
Heatsink Assembly	7

This section provides heatsink assembly instructions for the Intel® Xeon™ Processor with 800 MHz System Bus, Intel® E7520 Chipset, and Intel® 6300ESB ICH Development Kit:

Components requiring post-secondary heat sink assembly are listed in Table 9.

Table 9.	Components Requiring Heat Sink Assembly

	Component	Quantity per	Heat Sink	Part Number	Comments
	Component	Board	Manufacturer	Part Number	Comments
		Board	Manufacturer

	Processors	Up to 2	Cooler Master	E3W-N73CS-I1	Active heat sink + back plate.
	(See Figure 11.)	Up to 2	Cooler Master	E3W-N73CS-I1	Active heat sink + back plate.
	(See Figure 11.)

Figure 11. Components Requiring Heat Sink Assembly

Processors

(2)

Intel® Xeon™ Processor, Intel® E7520 Chipset, Intel® 6300ESB ICH Development Kit User’s Manual

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Intel 6300ESB ICH, Xeon user manual Heatsink Assembly, Components Requiring Heat Sink Assembly

Contents

September User’s ManualContents Contents ContentsLevel 3 Debug Voltage References ContentsHeatsink Assembly Processor Heat Sink Installation InstructionsContents FiguresTables Revision Revision HistoryContents DateProduct Overview 1.2 Product ContentsProduct Overview 1.1 Related DocumentsProduct Overview 1.3 Products Feature ListProduct Overview 1.4 Block Diagram1&1$ 1&0..&0 Figure 2. Placement - TopView+$&0,,+ Product OverviewSupported DIMM Module Types 1.4.2 DIMM Placement DDR2DIMM Placement DDR2 1.4.1 Memory SubsystemProduct Overview 1.5 Memory Population Rules and ConfigurationsFigure 3. DDR2 400 Memory - DIMM Ordering 2.3 Sleep States Supported 2.1 Power ButtonPlatform Management 2.2 Soft Off2.3.5 S4 State 2.3.2 S1 State2.3.3 S2 State 2.3.4 S3 State2.3.7 Wake-Up Events 2.4 PCI PM Support2.5 Platform Management 2.3.6 S5 StatePlatform Management 2.6 System Fan Operation2.5.1 Processor Thermal Management Equipment Required for CRB Usage 3.1 PrecautionsEquipment Required for CRB Usage Equipment Required for CRB Usage 3.2.1.1 Red Hat 8.0 Compatible Driver Package Contents3.2 Driver and OS Requirements 3.2.1 Drivers included on CDThis operating system compatible driver package is available from Equipment Required for CRB UsageEquipment Required for CRB Usage 3.2.1.3 Windows Compatible Driver Package Contents3.2.1.4 Third Party Drivers Jumpers and Headers Jumpers and Headers4.1 Jumpers Ref Des Jumper Settings Sheet 1 ofDescription/Settings Jumpers and HeadersRef Des Jumper Settings Sheet 2 ofDescription/Settings Jumpers and HeadersRef Des Jumper Settings Sheet 3 ofDescription/Settings Jumpers and HeadersSystem Overview 5.1 Power DiagramsBlock Diagram System OverviewSystem Overview Clock Block Diagram5.2 Platform Clocking HILAI$System Overview 5.3 Platform ResetsPlatform Reset Diagram PCI -EIntel SMBus Block Diagram5.4 SMBus System OverviewSystem Overview Figure 9. IRQ Routing Diagram5.5 Platform IRQ Routing System Overview Processor VRD Settings Sheet 1 of5.6 VRD VID Headers System Overview Processor VRD Settings Sheet 2 ofIntel Power Buttons5.7 Miscellaneous Buttons System OverviewLevel 1 Debug Port 80/BIOS Debug Procedure6.1 Level 1 Debug Port 80/BIOS Debug ProcedureLevel 3 Debug Voltage References 6.2 Level 2 Debug Power SequenceLevel 2 Debug Power Sequence 6.3 Level 3 Debug Voltage ReferencesFigure 11. Components Requiring Heat Sink Assembly Heatsink AssemblyHeatsink Assembly Components Requiring Heat Sink AssemblyHeatsink Assembly 7.1 Processor Heat Sink Installation InstructionsFigure 13. Cleaning the Processor Surface Figure 12. Inserting Processor in SocketRemove plastic Figure 14. Installing the Processor BackplateFigure 15. Removing the Protective Covers Heatsink AssemblyHeatsink Assembly Figure 16. Installing the Heatsink