Lenovo 8332 manual Drive carrier module, Cooling fan

Figure 10. Cooling fan

Airflow is front to rear with cooling air being drawn across the drives, through the fans and pressurizing the rear of the enclosure. The pressurized rear allows the PSU to draw the air that it requires; perforations at the rear of the chassis allow cooling air to flow over the processor heatsinks, server board and PCI cards.

The cooling system must be operated with low-pressure rear exhaust installation (back pressure created by rack doors and obstacles not to exceed 5 pascals [0.5mm Water gauge]).

The cooling system provides sufficient capacity to ensure that drive maximum temperatures have not exceeded at 35°C (95°F) with one failing fan at sea level.

The cooling cage contains ten individual high-speed single-rotor axial fans, individually connected to and interfacing with the enclosure management PCB. This interface provides power and speed control to the fans and returns speed output from each fan to the management system.

Drive carrier module

The drive carrier module consists of a hard disk mounted in a drive carrier. Each drive bay can house a single low-profile 2.54-cm (1.0-inch) high, 8.89-cm (3.5-inch) form factor SATA disk drive in its drive carrier. The drive carrier has mounting locations for SATA drives.

Each disk drive is enclosed in a sheet steel carrier which provides excellent thermal conduction, radio frequency and electro-magnetic induction protection, as well as affords the drive with maximum physical protection.

The front cap of the drive carrier supports an ergonomic handle, which provides the following functions:

vCamming of drive carrier into and out of drive bays.

vPositive "spring loading" of the drive/backpane connector.

10User Guide