LG Electronics LG-C320 specs

4. TROUBLE SHOOTING

HS_R	TP1
HS_L	TP1
SPK_N
SPK_P	TP1
	TP1

MUIC_AUD_FM_I2C_SCL

MUIC_AUD_FM_I2C_SDA

WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V

TP2	SPK_OUT_P
TP2	SPK_OUT_N
TP2
	HS_OUT_L
	HS_OUT_R

GND

Audio Sub

TP1_C509 TP1_C508 System(IC501) TP2_FB507 TP2_FB508

LGE Internal Use Only	- 74 -	Copyright © 2010 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

Image 73

LG Electronics LG-C320 service manual Audio Sub TP1C509 TP1C508 SystemIC501 TP2FB507 TP2FB508

Contents

Internal Use Only LG-C320 Table Of Contents LGE Internal Use Only Regulatory Information Purpose Interference and Attenuation PicturesElectrostatic Sensitive Devices Abbreviations PCB PAMPGA PLL Feature Comment Main Parts GSM SolutionProduct Name Supporting Standard HW Features MP3/AAC/AAC+/WMA Music PlayerCdrom Stereo Headset Yes Data Cable Flash External Memory SW Features Eons Cphs MMSENS 2M FF HW Spec GSM transceiver specification Specification C320 Figures General Description QSC62703G disable Base band block 1 Processors and bus architecture Processor EBI2 Memory support and LCD interface Qvga Main QSC6270 3G disable Connectivity QSC6270 GPIOs QSC6270 3G disable has 78 configurable I/O pins Air interfaces Enhanced GPS position location using gpsOne with RGR6240 ICInternal base band functions JTAG/ETM Camera interface and video front-end Multimedia Mobile display processor 7.2.1 MDP-to-LCD interface functional block diagram 7.2.2 The LCD interface of C320 9 USB UartHkadc QSC6270HKADC Block diagram Input power management Power managementValid external supply attachment and removal detection Output voltage regulation 2 Voltage regulator summary ˆ™Ž•Ž YlTŠˆ™Ž•Ž Charging control–”—“Œ›Œ‹ KEY PAD Technical Brief SUB System EBI2 Features EBI1 FeaturesExternal memory interface Sdram 3.1 2M Camera Camera Interface 2M Camera Technical Brief General Description LCD Module LQ024Q3UX01 Sharp PIN Description Input Signal and Power Pin Description Input Pin Technical Brief Audio Signal Processing & Interface General Description RF Part 41 Block diagram of RF part GSM 850 869 to 894 MHz and GSM 900 925 to 960 MHz Low-bandHigh-band 1 QSC GSM receiver signal paths functional diagram GSM Transmitter 1 D5008 FL101 FEM 1 Block diagram of FEM 1 Control table of FEM 2 Block diagram of GSM PAM Shows the Bluetooth system architecture in the LG-C320 Bluetooth BCM2070 Bluetooth ConnectionGPIO with QSC6270 FM TEA5991 FM Receiver TEA5991ESC6270 2 pin description When Power key press? Yes Power on TroubleshootingStart Than 3.20V? Yes TP1 Connection OK? Change I/O connector Yes Charger TroubleshootingCharger Troubleshooting Flow Yes Change TA Is it charging properly? TP1 FL401 USB Troubleshooting Flow USB Troubleshooting TP3 Re-insert the SIM card Work well ? Usim Detect TroubleshootingYes Change the SIM card Work well ? Check J301 TP1 TP2 TP4 Camera TroubleshootingTP3 CAM70MHz Pclk CAM24MHz Mclk TP4 TP3 TP1 TP2 Check battery Change QSC6270 Change LED Yes Main side view LED TroubleshootingKey press +VPWR is above 3.2V? Yes LED on ? Slide Key side view LED Troubleshooting SUB KEY B/L Change the Fpcb Move to KEY LED Troubleshooting LCD TroubleshootingLCD display OK? Yes Change SUB PCB LCD display OK? Yes Slide Side view placement Vibrator is operate when DC motor driver is enabled Vibrator TroubleshootingAbove 3.0V or Linmotm Main to Fsubfpcb ConnectorCN803 Fsubfpcb to Main PCB ConnectorCN101 Receiver Path TP1 Main to Slide Fpcb ConnectorCN801 TP4Receiver PAD=CN101 TP3FB102 TP3FB101 Change the IC501 TP1C506, C507? TP3FB505 TP3FB504 TP2R505 TP2R504 TP1C507 TP1C506 Speaker/Speaker Phone path Audio Sub TP1C509 TP1C508 SystemIC501 TP2FB507 TP2FB508 TP3 TP4 TP5CN102=Speaker Pad Make a call Main microphoneMICBIASTP1C526 Work well? Mainmicp Insert Headset & Make a call Headset microphoneTP2FB503? Yes TP3C263? Yes Hsgnd U201 X202 FL101 SW101 U101 RF Component GSM path RF Path GSM850/GSM900/1800/1900 Trouble Shooting of GSM Part Egsm CH Setup Test Equipnment Cell power = -74dbmDCS1800 CH PCS1900 CH GSM850 CH Check Rx Part Tx Part Check U201 Replace FL101 Checking Front-End Module Block TP1 TP2 GSM Rx is OK Checking GSM Rx part 17.3 Gpam Logic Control DCS/PCS = Trouble Shooting Bluetooth RF components Checking Bluetooth BlockRF component BT Main board bottom Reference Description ANT Bluetooth Signal Path Main board bottom Bluetooth Signal Path TP# Bluetooth Trouble shootingTP1 VREGMSMP2.6V TP2 VREGMSME1.8V TP3 TP4 Btantout ConnectivityANTPAD BT main clk 26MHz Class Checking FM Radio Block FM Signal PathReference Description U701 TEA5991FM module FM Trouble shooting TP description Fmoutaudio signalTP1 VREGMSMP2.6V TP2 VREGMSME1.8V TP3 Fmantin TP4 LG-C320 Download LG-C320 LGE Internal Use Only 101 102 103 104 105 106 107 108 109 LG-C320 LG-C320 110 LG-C320 LG-C320 111 LG-C20 112 Block Diagram Usbvbus 113 Vbat 114 Memory 115 116 117 118 ESC6270 119 120 WM9093 121 QSC6270 122 123 Circuit Diagram 124 2-1ESCESC6270 NET Conn 126 MCP2-12G1G DDRx16hynix 127 3-2 128 2-1 129 6CH+4LDO,PWM 130 ConnectivityANTPAD 131 1-1 132 1-3push1.50T 133 KEY PCB 134 Slide Fpcb 135 Module Fpcb 136 BGA Pin Map QSC6270 3G disableٛ- U200 bottom view137 138 H8BCS0SI0BAR-46M MCP,NAND U300 EUSY0347506 139 BCM2070B2KUBXG bluetooth U700 EUSY0418701 140 Bump CSP package Top View WM9093 Ultra Low Power Audio Subsystem- IC500 EUSY0403901141 142 TEA5991FM Tuner- U701 EUSY0385901 143 LD801/802 Main Key LED Can not use LED FL101 FEM IC401 MuicU101 GSM PAM 145 C320KEYSPEY006820110TOP 146 CN102 LCD Connector Can not use LCD Display, LCD Backlight 147 C320FSLIDESPCY024690110TOP 148 CN101 Fpcb Conn Can not use SD-card, Vibrator, Speaker Procedure Preparation work for setting RF cable lossUsage of Tachyon for RF Calibration and Test 149 System Option Setting Basic Setting of Tachyon for RF Calibration & Test150 Log of RF Calibration and Test Contents 152 Phone Test Mode 153 Order 154 155 156 157 Exploded View & Replacement Part List 158 159 160 161 162 LGC320.ABOOWA Flexible 163Hankook Molex Mobitech Corporation 164 LG-C320 Boowa Main 165RESIN,PC TP TDK Korea Cooperation TP TDK Corporation 166Kyocera Corp Rohm 167 AUK Corp 168 FET 169ESM R/TP 3P KEC Corporaition IC,MCP,NAND 170H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V 171 172 QCT Skyworks Solutions INCSPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42 Printed Circuit Board Corp ECZH0001217 173 Microelectronics PLC 174Ceratech Corporation 175 Accessory