LG C320 Cell Phone Manual - Troubleshooting Guide

4. TROUBLE SHOOTING

			CN101
			G1	G2
		1		20
	SPK_OUT_P	2	TP4	19
	SPK_OUT_P	3		18
		3		18
	SPK_OUT_N	4		17
	SPK_OUT_N	5		16
		5		16
		6		15
		7		14
	MOTOR_POWER_N	8		13
	MOTOR_POWER_N	9		12
	VBAT	9		12
	VBAT	10		11
		10		11
			G3	G4

TP4

MSD_D[2]

MSD_D[3]

MSD_CMD

VREG_MICROSD_3V0

MSD_CLK

MSD_D[0]

MSD_D[1]

10

F_SUB_FPCB to Main PCB Connector(CN101)

LGE Internal Use Only	- 76 -	Copyright © 2010 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

Image 75

LG Electronics LG-C320 service manual TP4

Contents

Internal Use Only LG-C320 Table Of Contents LGE Internal Use Only Regulatory Information Purpose Pictures Interference and AttenuationElectrostatic Sensitive Devices Abbreviations PLL PAMPCB PGA Supporting Standard Main Parts GSM SolutionFeature Comment Product Name HW Features Stereo Headset Yes Data Cable Flash External Memory Music PlayerMP3/AAC/AAC+/WMA Cdrom SW Features 2M FF MMSEons Cphs ENS HW Spec GSM transceiver specification Specification C320 Figures General Description QSC62703G disable Base band block 1 Processors and bus architecture Processor EBI2 Memory support and LCD interface Qvga Main QSC6270 3G disable Connectivity QSC6270 GPIOs QSC6270 3G disable has 78 configurable I/O pins JTAG/ETM Enhanced GPS position location using gpsOne with RGR6240 ICAir interfaces Internal base band functions Camera interface and video front-end Multimedia Mobile display processor 7.2.1 MDP-to-LCD interface functional block diagram 7.2.2 The LCD interface of C320 Uart 9 USBHkadc QSC6270HKADC Block diagram Power management Input power managementValid external supply attachment and removal detection Output voltage regulation 2 Voltage regulator summary Charging control ˆ™Ž•Ž YlTŠˆ™Ž•Ž–”—“Œ›Œ‹ KEY PAD Technical Brief SUB System Sdram EBI1 FeaturesEBI2 Features External memory interface 3.1 2M Camera Camera Interface 2M Camera Technical Brief General Description LCD Module LQ024Q3UX01 Sharp PIN Description Input Signal and Power Pin Description Input Pin Technical Brief Audio Signal Processing & Interface General Description RF Part 41 Block diagram of RF part Low-band GSM 850 869 to 894 MHz and GSM 900 925 to 960 MHzHigh-band 1 QSC GSM receiver signal paths functional diagram GSM Transmitter 1 D5008 FL101 FEM 1 Block diagram of FEM 1 Control table of FEM 2 Block diagram of GSM PAM Shows the Bluetooth system architecture in the LG-C320 Bluetooth BCM2070 Bluetooth ConnectionGPIO with QSC6270 FM Receiver TEA5991 FM TEA5991ESC6270 2 pin description Than 3.20V? Yes Power on TroubleshootingWhen Power key press? Yes Start TP1 Yes Change TA Is it charging properly? Charger TroubleshootingConnection OK? Change I/O connector Yes Charger Troubleshooting Flow TP1 FL401 USB Troubleshooting Flow USB Troubleshooting TP3 Check J301 Usim Detect TroubleshootingRe-insert the SIM card Work well ? Yes Change the SIM card Work well ? TP1 TP2 Camera Troubleshooting TP4TP3 CAM70MHz Pclk CAM24MHz Mclk TP4 TP3 TP1 TP2 LED on ? Main side view LED TroubleshootingCheck battery Change QSC6270 Change LED Yes Key press +VPWR is above 3.2V? Yes Slide Key side view LED Troubleshooting SUB KEY B/L Change SUB PCB LCD display OK? Yes LCD TroubleshootingChange the Fpcb Move to KEY LED Troubleshooting LCD display OK? Yes Slide Side view placement Vibrator Troubleshooting Vibrator is operate when DC motor driver is enabledAbove 3.0V or Linmotm Main to Fsubfpcb ConnectorCN803 Fsubfpcb to Main PCB ConnectorCN101 Receiver Path TP1 Main to Slide Fpcb ConnectorCN801 TP4Receiver PAD=CN101 TP3FB102 TP3FB101 Change the IC501 TP1C506, C507? TP3FB505 TP3FB504 TP2R505 TP2R504 TP1C507 TP1C506 Speaker/Speaker Phone path Audio Sub TP1C509 TP1C508 SystemIC501 TP2FB507 TP2FB508 TP3 TP4 TP5CN102=Speaker Pad Work well? Main microphoneMake a call MICBIASTP1C526 Mainmicp TP3C263? Yes Headset microphoneInsert Headset & Make a call TP2FB503? Yes Hsgnd U201 X202 FL101 SW101 U101 RF Component GSM path RF Path GSM850/GSM900/1800/1900 Trouble Shooting of GSM Part Check Rx Part Tx Part Setup Test Equipnment Cell power = -74dbmEgsm CH DCS1800 CH PCS1900 CH GSM850 CH Check U201 Replace FL101 Checking Front-End Module Block TP1 TP2 GSM Rx is OK Checking GSM Rx part 17.3 Gpam Logic Control DCS/PCS = Trouble Shooting ANT Checking Bluetooth BlockBluetooth RF components RF component BT Main board bottom Reference Description Bluetooth Signal Path Main board bottom Bluetooth Signal Path TP4 Btantout Bluetooth Trouble shootingTP# TP1 VREGMSMP2.6V TP2 VREGMSME1.8V TP3 ConnectivityANTPAD BT main clk 26MHz Class FM Signal Path Checking FM Radio BlockReference Description U701 TEA5991FM module FM Trouble shooting Fmoutaudio signal TP descriptionTP1 VREGMSMP2.6V TP2 VREGMSME1.8V TP3 Fmantin TP4 LG-C320 Download LG-C320 LGE Internal Use Only 101 102 103 104 105 106 107 108 109 LG-C320 LG-C320 110 LG-C320 LG-C320 111 LG-C20 112 Block Diagram Usbvbus 113 Vbat 114 Memory 115 116 117 118 ESC6270 119 120 WM9093 121 QSC6270 122 123 Circuit Diagram 124 2-1ESCESC6270 NET Conn 126 MCP2-12G1G DDRx16hynix 127 3-2 128 2-1 129 6CH+4LDO,PWM 130 ConnectivityANTPAD 131 1-1 132 1-3push1.50T 133 KEY PCB 134 Slide Fpcb 135 Module Fpcb 136 QSC6270 3G disableٛ- U200 bottom view BGA Pin Map137 138 H8BCS0SI0BAR-46M MCP,NAND U300 EUSY0347506 139 BCM2070B2KUBXG bluetooth U700 EUSY0418701 140 WM9093 Ultra Low Power Audio Subsystem- IC500 EUSY0403901 Bump CSP package Top View141 142 TEA5991FM Tuner- U701 EUSY0385901 143 LD801/802 Main Key LED Can not use LED IC401 Muic FL101 FEMU101 GSM PAM 145 C320KEYSPEY006820110TOP 146 CN102 LCD Connector Can not use LCD Display, LCD Backlight 147 C320FSLIDESPCY024690110TOP 148 CN101 Fpcb Conn Can not use SD-card, Vibrator, Speaker 149 Preparation work for setting RF cable lossProcedure Usage of Tachyon for RF Calibration and Test Basic Setting of Tachyon for RF Calibration & Test System Option Setting150 Log of RF Calibration and Test Contents 152 Phone Test Mode 153 Order 154 155 156 157 Exploded View & Replacement Part List 158 159 160 161 162 Mobitech Corporation 163LGC320.ABOOWA Flexible Hankook Molex 164 TP TDK Korea Cooperation 165LG-C320 Boowa Main RESIN,PC Rohm 166TP TDK Corporation Kyocera Corp 167 AUK Corp 168 169 FETESM R/TP 3P KEC Corporaition 170 IC,MCP,NANDH8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V 171 Printed Circuit Board Corp QCT Skyworks Solutions INC172 SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42 ECZH0001217 173 174 Microelectronics PLCCeratech Corporation 175 Accessory