Processors and bus architecture | LG Electronics LG-C320 instruction

3. TECHNICAL BRIEF

3.1.1 Processor

The QSC6270(3Gdisable) device integrates multiple processors on-chip: one ARM microprocessor and two DSP processors. Each processor is part of a functional subsystem:

The micro subsystem includes the ARM926EJ-S microprocessor.

The modem subsystem includes the QDSP4u8 digital signal processor (mDSP).

The application subsystem includes the QDSP4u8 application digital signal processor(aDSP).

Figure 3.1.1 Processors and bus architecture

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LG Electronics LG-C320 service manual Processors and bus architecture

Contents

LG-C320 Internal Use Only Table Of Contents LGE Internal Use Only Purpose Regulatory Information Interference and Attenuation PicturesElectrostatic Sensitive Devices Abbreviations PAM PCBPGA PLL Main Parts GSM Solution Feature CommentProduct Name Supporting Standard HW Features Music Player MP3/AAC/AAC+/WMACdrom Stereo Headset Yes Data Cable Flash External Memory SW Features MMS Eons CphsENS 2M FF GSM transceiver specification Specification HW Spec C320 Figures QSC62703G disable Base band block General Description Processor 1 Processors and bus architecture Memory support and LCD interface EBI2 QSC6270 3G disable Qvga Main QSC6270 Connectivity QSC6270 3G disable has 78 configurable I/O pins GPIOs Enhanced GPS position location using gpsOne with RGR6240 IC Air interfacesInternal base band functions JTAG/ETM Multimedia Camera interface and video front-end 7.2.1 MDP-to-LCD interface functional block diagram Mobile display processor 7.2.2 The LCD interface of C320 9 USB UartHkadc QSC6270HKADC Block diagram Input power management Power managementValid external supply attachment and removal detection Output voltage regulation 2 Voltage regulator summary ˆ™Ž•Ž YlTŠˆ™Ž•Ž Charging control–”—“Œ›Œ‹ Technical Brief SUB System KEY PAD EBI1 Features EBI2 FeaturesExternal memory interface Sdram Camera Interface 2M Camera 3.1 2M Camera Technical Brief LCD Module LQ024Q3UX01 Sharp General Description Input Signal and Power Pin Description Input Pin PIN Description Technical Brief Audio Signal Processing & Interface 41 Block diagram of RF part General Description RF Part GSM 850 869 to 894 MHz and GSM 900 925 to 960 MHz Low-bandHigh-band 1 QSC GSM receiver signal paths functional diagram GSM Transmitter 1 Block diagram of FEM 1 Control table of FEM 1 D5008 FL101 FEM 2 Block diagram of GSM PAM Bluetooth BCM2070 Shows the Bluetooth system architecture in the LG-C320 Bluetooth ConnectionGPIO with QSC6270 FM TEA5991 FM Receiver TEA5991ESC6270 2 pin description Power on Troubleshooting When Power key press? YesStart Than 3.20V? Yes TP1 Charger Troubleshooting Connection OK? Change I/O connector YesCharger Troubleshooting Flow Yes Change TA Is it charging properly? TP1 FL401 USB Troubleshooting USB Troubleshooting Flow TP3 Usim Detect Troubleshooting Re-insert the SIM card Work well ?Yes Change the SIM card Work well ? Check J301 TP1 TP2 TP4 Camera TroubleshootingTP3 TP4 TP3 TP1 TP2 CAM70MHz Pclk CAM24MHz Mclk Main side view LED Troubleshooting Check battery Change QSC6270 Change LED YesKey press +VPWR is above 3.2V? Yes LED on ? Slide Key side view LED Troubleshooting SUB KEY B/L LCD Troubleshooting Change the Fpcb Move to KEY LED TroubleshootingLCD display OK? Yes Change SUB PCB LCD display OK? Yes Slide Side view placement Vibrator is operate when DC motor driver is enabled Vibrator TroubleshootingAbove 3.0V or Linmotm Fsubfpcb to Main PCB ConnectorCN101 Main to Fsubfpcb ConnectorCN803 Receiver Path Main to Slide Fpcb ConnectorCN801 TP1 TP4Receiver PAD=CN101 TP3FB102 TP3FB101 TP1C506, C507? Change the IC501 TP3FB505 TP3FB504 TP2R505 TP2R504 TP1C507 TP1C506 Speaker/Speaker Phone path Audio Sub TP1C509 TP1C508 SystemIC501 TP2FB507 TP2FB508 TP3 TP4 TP5CN102=Speaker Pad Main microphone Make a callMICBIASTP1C526 Work well? Mainmicp Headset microphone Insert Headset & Make a callTP2FB503? Yes TP3C263? Yes Hsgnd RF Component U201 X202 FL101 SW101 U101 RF Path GSM path Trouble Shooting of GSM Part GSM850/GSM900/1800/1900 Setup Test Equipnment Cell power = -74dbm Egsm CHDCS1800 CH PCS1900 CH GSM850 CH Check Rx Part Tx Part Checking Front-End Module Block Check U201 Replace FL101 TP1 TP2 Checking GSM Rx part GSM Rx is OK DCS/PCS = 17.3 Gpam Logic Control Trouble Shooting Checking Bluetooth Block Bluetooth RF componentsRF component BT Main board bottom Reference Description ANT Bluetooth Signal Path Bluetooth Signal Path Main board bottom Bluetooth Trouble shooting TP#TP1 VREGMSMP2.6V TP2 VREGMSME1.8V TP3 TP4 Btantout ConnectivityANTPAD Class BT main clk 26MHz Checking FM Radio Block FM Signal PathReference Description U701 TEA5991FM module FM Trouble shooting TP description Fmoutaudio signalTP1 VREGMSMP2.6V TP2 VREGMSME1.8V TP3 Fmantin TP4 Download LG-C320 LG-C320 LGE Internal Use Only 101 102 103 104 105 106 107 108 LG-C320 LG-C320 109 LG-C320 LG-C320 110 LG-C20 111 Block Diagram 112 113 Usbvbus 114 Vbat 115 Memory 116 117 118 119 ESC6270 WM9093 120 QSC6270 121 122 Circuit Diagram 123 2-1ESCESC6270 124 NET Conn MCP2-12G1G DDRx16hynix 126 3-2 127 2-1 128 6CH+4LDO,PWM 129 ConnectivityANTPAD 130 1-1 131 1-3push1.50T 132 KEY PCB 133 Slide Fpcb 134 Module Fpcb 135 136 BGA Pin Map QSC6270 3G disableٛ- U200 bottom view137 H8BCS0SI0BAR-46M MCP,NAND U300 EUSY0347506 138 BCM2070B2KUBXG bluetooth U700 EUSY0418701 139 140 Bump CSP package Top View WM9093 Ultra Low Power Audio Subsystem- IC500 EUSY0403901141 TEA5991FM Tuner- U701 EUSY0385901 142 LD801/802 Main Key LED Can not use LED 143 FL101 FEM IC401 MuicU101 GSM PAM C320KEYSPEY006820110TOP 145 CN102 LCD Connector Can not use LCD Display, LCD Backlight 146 C320FSLIDESPCY024690110TOP 147 CN101 Fpcb Conn Can not use SD-card, Vibrator, Speaker 148 Preparation work for setting RF cable loss ProcedureUsage of Tachyon for RF Calibration and Test 149 System Option Setting Basic Setting of Tachyon for RF Calibration & Test150 Contents Log of RF Calibration and Test Phone Test Mode 152 Order 153 154 155 156 Exploded View & Replacement Part List 157 158 159 160 161 162 163 LGC320.ABOOWA FlexibleHankook Molex Mobitech Corporation 164 165 LG-C320 Boowa MainRESIN,PC TP TDK Korea Cooperation 166 TP TDK CorporationKyocera Corp Rohm 167 168 AUK Corp FET 169ESM R/TP 3P KEC Corporaition IC,MCP,NAND 170H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V 171 QCT Skyworks Solutions INC 172SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42 Printed Circuit Board Corp 173 ECZH0001217 Microelectronics PLC 174Ceratech Corporation Accessory 175