NXP Semiconductors TDA8752B 9.3 3-wire serial bus protocol

Philips Semiconductors TDA8752B

Triple high-speed Analog-to-Digital Converter 110 Msps

Product speciﬁcation Rev. 03 — 21 July 2000 23 of 38

9.3 3-wire serial bus protocol

Forthe 3-wire ser ial busthe ﬁrst byte refers to the register address which is programmed. The second byte refers to the

data to be sent to the chosen register (see Tabl e 4). The acquisition is achieved via SEN.

Using the 3-wire serial bus interface, an indeﬁnite number of ICs can operate on the same system. PinSEN is used to

validate the circuits.

Fig 10. 3-wire serial bus protocol.

FCE474

ts3W = 100 ns th3W = 100 ns

tr3W = 600 ns 100 ns

1199

XXXXA3A2A1A0XD7D6D5D4D3D2D1D0X

SEN

SCL

SDA

Contents

Main TDA8752B Triple high-speed Analog-to-Digital Converter 110 Msps Rev. 03 21 July 2000 Product specication 1. General description 2. Features 3. Applications 4. Quick reference data 5. Ordering information 6. Block diagram RED CHANNEL BLUE CHANNEL TDA8752B Fig 1. Block diagram. Philips Semiconductors TDA8752B Fig 2. Red channel diagram. Fig 3. PLL diagram. 7. Pinning information TDA8752BH Fig 4. Pin conguration. 7.1 Pinning Philips Semiconductors TDA8752B 7.2 Pin description Page Triple high-speed Analog-to-Digital Converter 110 Msps 8. Functional description 8.1 IC analog video inputs 8.2 Clamps 8.3 Variable gain ampliers Page 8.4 ADCs 8.5 ADC outputs 8.6 Phase-locked loop Page 8.7 I2C-bus and 3-wire serial bus interface Slave at 180 deg phase shift with respect to pinCKADCO of the master TDA8752B. Fig 9. Dual TDA8752B solution for pixel clock rate with a single phase adjustment (100to 200 MHz). PLL Master TDA8752B (even pixels) PLL Slave TDA8752B (odd pixels) 9. I2C-bus and 3-wire serial bus interfaces 9.1 Register denitions 9.2 I2C-bus protocol 9.3 3-wire serial bus protocol 10. Limiting values 11. Thermal characteristics 12. Characteristics Page Page Page Page Fig 11. Data timing diagram. Fig 12. Timing diagram and test conditions of 3-state output delay time. V =25 =5V; T C. 13. Application information TDA8752B Fig 13. Application diagram. 14. Package outline Fig 14. SOT317-2 package outline. QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT317-2 15. Handling information 16. Soldering 16.1 Introduction to soldering surface mount packages Data Handbook IC26; Integrated Circuit Packages 16.2 Reow soldering 17. Revision history 18. Data sheet status 19. Denitions 21. Licenses 20. Disclaimers Philips Semiconductors - a worldwide company Internet: http://www.semiconductors.philips.com Contents