Philips Semiconductors TDA8752B
Triple high-speed Analog-to-Digital Converter 110 Msps
Product specification Rev. 03 — 21 July 2000 32 of 38
9397 750 07338 © Philips Electronics N.V. 2000. All rights reserved.
14. Package outline

Fig 14. SOT317-2 package outline.

UNIT A1A2A3bpcE
(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 2.90
2.65 0.25 0.40
0.25 0.25
0.14 14.1
13.9 0.65 18.2
17.6 1.0
0.6 7
0
o
o
0.15 0.10.21.95
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT317-2 MO-112 97-08-01
99-12-27
D(1) (1)(1)
20.1
19.9
HD
24.2
23.6
E
Z
0.8
0.4
D
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
30
c
bp
E
HA2
D
ZD
A
ZE
e
vMA
1
100
81
80 51
50
31
pin 1 index
X
y
bp
D
HvMB
wM
wM
0 5 10 mm
scale

QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT317-2

A
max.
3.20