Reference Information
11.2 Acronyms and Abbreviations(1)
The table below explains the abbreviations and acronyms used in this service manual. Where abbreviations or acronyms are used in the text please refer to this table.
Abbreviations | Explanation |
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AP | Access Point |
AC | Alternating Current |
APC | Auto Power Control |
ASIC | Application Specific Integrated Circuit |
ASSY | assembly |
BIOS | Basic Input Output System |
BLDC | |
CMOS | Complementary Metal Oxide Semiconductor |
CN | connector |
CON | connector |
CPU | Central Processing Unit |
dB | decibel |
dbA | decibel A |
dBM | decibel milliwatt |
DC | direct current |
DCU | Diagnostic Control Unit |
DPI | Dot Per Inch |
DRAM | Dynamic Random Access Memory |
DVM | Digital Voltmeter |
ECP | Enhanced Capability Port |
EDC | Embedded Diagnostic control |
EEPROM | Electronically Erasable Programmable Read Only Memory |
EMI | Electro Magnetic Interference |
EP | electrophotographic |
EPP | Enhanced Parallel Port |
FPOT | First Printout Time |
F/W | firmware |
GDI | graphics device interface |
GND | ground |
HBP | Host Based Printing |
HDD | Hard Disk Drive |
H/H | High temperature and high marshy place |
HV | high voltage |
HVPS | High Voltage Power Supply |
I/F | interface |
I/O | Input and Output |
IC | integrated circuit |
IDE | Intelligent Drive electronics or Imbedded Drive Electronics |
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