Reference Information

11.2 Acronyms and Abbreviations(1)

The table below explains the abbreviations and acronyms used in this service manual. Where abbreviations or acronyms are used in the text please refer to this table.

Abbreviations

Explanation

 

 

AP

Access Point

AC

Alternating Current

APC

Auto Power Control

ASIC

Application Specific Integrated Circuit

ASSY

assembly

BIOS

Basic Input Output System

BLDC

Brush-less Direct Current

CMOS

Complementary Metal Oxide Semiconductor

CN

connector

CON

connector

CPU

Central Processing Unit

dB

decibel

dbA

decibel A

dBM

decibel milliwatt

DC

direct current

DCU

Diagnostic Control Unit

DPI

Dot Per Inch

DRAM

Dynamic Random Access Memory

DVM

Digital Voltmeter

ECP

Enhanced Capability Port

EDC

Embedded Diagnostic control

EEPROM

Electronically Erasable Programmable Read Only Memory

EMI

Electro Magnetic Interference

EP

electrophotographic

EPP

Enhanced Parallel Port

FPOT

First Printout Time

F/W

firmware

GDI

graphics device interface

GND

ground

HBP

Host Based Printing

HDD

Hard Disk Drive

H/H

High temperature and high marshy place

HV

high voltage

HVPS

High Voltage Power Supply

I/F

interface

I/O

Input and Output

IC

integrated circuit

IDE

Intelligent Drive electronics or Imbedded Drive Electronics

 

 

11-2Service Manual

Samsung Electronics

Page 125
Image 125
Samsung ML-2015/XEV manual Acronyms and Abbreviations1, Abbreviations Explanation