Service Manual
Reference Information
11-2
Samsung Electronics

11.2 Acronyms and Abbreviations(1)

The table below explains the abbreviations and acronyms used in this service manual. Where abbreviations

or acronyms are used in the text please refer to this table.

Abbreviations Explanation
AP Access Point
AC Alternating Current
APC Auto Power Control
ASIC Application Specific Integrated Circuit
ASSY assembly
BIOS Basic Input Output System
BLDC Brush-less Direct Current
CMOS Complementary Metal Oxide Semiconductor
CN connector
CON connector
CPU Central Processing Unit
dB decibel
dbA decibel A
dBM decibel milliwatt
DC direct current
DCU Diagnostic Control Unit
DPI Dot Per Inch
DRAM Dynamic Random Access Memory
DVM Digital Voltmeter
ECP Enhanced Capability Port
EDC Embedded Diagnostic control
EEPROM Electronically Erasable Programmable Read Only Memory
EMI Electro Magnetic Interference
EP electrophotographic
EPP Enhanced Parallel Port
FPOT First Printout Time
F/W firmware
GDI graphics device interface
GND ground
HBP Host Based Printing
HDD Hard Disk Drive
H/H High temperature and high marshy place
HV high voltage
HVPS High Voltage Power Supply
I/F interface
I/O Input and Output
IC integrated circuit
IDE Intelligent Drive electronics or Imbedded Drive Electronics