Sony MX-E501 service manual Main Board

MZ-E501

2-2. PRINTED WIRING BOARD – MAIN SECTION (SIDE A) –

1

2

3

4

5

6

7

8

9

10

11

12

13

14

A

MAIN BOARD

(SIDE A)

B

E

12

10

7

13

6

• Semiconductor

15

5

S801

IC 301

Location

18

1

Ref. No.

Location

19

24

*

D101

C-13

C

IC 601

C301

D201

C-13

D801

G-10

CSP (Chip Size Package)

D855

E-13

S806

D902

H-13

GROUP

D903

G-14

IC301

B-12

D

IC501

H-5

IC601

C-6

IC901

G-12

Q301

B-11

Q501

H-3

Q901

G-11

E

Q902

F-11

S803

Q903

F-11

S808

HOLD

S804

ON

VOL-

F

DRY BATTERY

OFF

SIZE "AA"

(IEC DESIGNATION LR6)

1PC, 1.5V

G

(INFO)

IC 901

S805

S802

VOL+

H

E

IC 501

1-681-868-

12

(12)

I

Note on Printed Wiring Boards

•X : parts extracted from the component side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from the
(Side B)	pattern face are indicated.
Parts face side:	Parts on the parts face side seen from the
(Side A)	parts face are indicated.

•Main boards is four-layer pritnted board.

However, the patterns of layer 2 and 3 have not been included in this diagrams.

*Replacement of IC601 used in this set requires a special tool.

• Lead Layouts surface

Lead layout of	CSP (chip size package)
conventional IC

44