Sony MZ-E505 Waveforms, 6 IC501 ed RF OUT, Note on Printed Wiring Board, Approx. 760 mVp-p

MZ-E505

6-2. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

• Waveforms

1 IC501 1 (TE)

6 IC501 ed (RF OUT)

qa IC601 th (TE)

Note on Printed Wiring Board:

•X: parts extracted from the component side.

•Y: parts extracted from the conductor side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from
(Conductor Side)	the pattern face are indicated.
Parts face side:	Parts on the parts face side seen from
(Component Side)	the parts face are indicated.

Note on Schematic Diagram:

•All capacitors are in ∝ F unless otherwise noted. pF: ∝∝ F 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•C: panel designation.

•A: B+ Line.

Note: The components identified by mark 0or dotted line with mark 0are critical for safety.

Replace only with part number specified.

200 mV/DIV, 1 ∝ s/DIV

Approx. 760 mVp-p

500 mV/DIV, 500 ns/DIV

200 mV/DIV, 1 ∝ s/DIV

1.0 Vp-p

Approx. 760 mVp-p

•MAIN board is four-layer printed board.

However, the patterns of layers 2 and 3 have not been included in this diagrams.

*Replacement of IC601 used in this set requires a spe- cial tool.

• Lead Layouts surface

•	Total current is measured with MD installed.
• Power voltage is dc 3 V and fed with regulated dc power
	supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground in
	playback mode (servo circuit ON).
	no mark : PLAYBACK
	∗	: Impossible to measure
•	Voltages are taken with a VOM (Input impedance 10 MΩ ).
	Voltage variations may be noted due to normal produc-
	tion tolerances.
•	Waveforms are taken with a oscilloscope.
	Voltage variations may be noted due to normal produc-
	tion tolerances.
•	Circled numbers refer to waveforms.
•	Signal path.

2IC501 8 (Iy)

100 mV/DIV, 1 ∝ s/DIV

7 IC501 rs (FE)

200 mV/DIV, 1 ∝ s/DIV

200 mVp-p

	qs IC601 ih (FS4)
	500 mV/DIV, 2 ∝ s/DIV
Approx.	1.9 Vp-p
620 mVp-p

Lead layout of conventional IC CSP (chip size package)

E : PLAYBACK

5.68∝ s

* Replacement of IC601 used in this set requires a spe-

cial tool.

• The voltage and waveform of CSP (chip size package)

cannot be measured, because its lead layout is different

form that of conventional IC.

3 IC501 9 (Ix)	8 IC601 wg (OSCO)
100 mV/DIV, 1 ∝ s/DIV	500 mV/DIV, 10 ∝ s/DIV

130 mVp-p

			22.2 ∝ s
4 IC501 q; (Jx)	9 IC601 ej (RFI)
100 mV/DIV, 1 ∝ s/DIV		500 mV/DIV, 500 ns/DIV

qd IC901 th (CLK)
500 mV/DIV, 2 ∝ s/DIV
2.1 Vp-p	1.9 Vp-p
5.68 ∝	s

150 mVp-p 1.0 Vp-p

5IC501 qa (Jy)

100 mV/DIV, 1 ∝ s/DIV

q; IC601 rj (FE)

200 mV/DIV, 1 ∝ s/DIV

180 mVp-p

Approx. 620 mVp-p

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