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Sony MZ-NH1 Note 1:, Note 2:, 3-1.DISASSEMBLY FLOW, 3-2.BOTTOM PANEL SUB ASSY

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MZ-NH1

SECTION 3

DISASSEMBLY

•This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

Note 1: The process described in can be performed in any order.

Note 2: Without completing the process described in , the next process can not be performed.

SET

3-2. BOTTOM PANEL SUB ASSY (Page 7)

3-3. MAIN BOARD

3-4.

UPPER PANEL SUB ASSY

(Page 8)

(Page 8)

3-5. CONTROL ORNAMENT BLOCK

(Page 9)

3-6.

MECHANISM DECK ASSY (MT-MZNH1-181)

(Page 9)

3-7.

GEAR (SA), GEAR (SB)

(Page 10)

3-8.

OP SERVICE ASSY

(Page 10)

3-9.

DC SSM18D/C-NP MOTOR (SPINDLE) (M701),

3-10. HOLDER ASSY

DC SSM21A/C-NP MOTOR (SLED) (M702),

(Page 11)

DC MOTOR UNIT(OVER WRITE HEAD UP/DOWN) (M703)

(Page 11)

Note: Follow the disassembly procedure in the numerical order given.

3-2. BOTTOM PANEL SUB ASSY

3bottom panel sub assy

S895

Note: When installing the bottom panel sub assy, adjust the position of switch (S895) and knob (hold).

1two screws (M1.4) L=1.6

knob (hold)

2two screws (M1.4) L=1.6

7

Contents

SPECIFICATIONS Sony Corporation Personal Audio Company Page TABLE OF CONTENTS SERVICING NOTES GENERAL 3.DISASSEMBLY TEST MODE NOTES ON HANDLING THE OPTICAL PICK-UPBLOCK OR BASE UNIT NOTES ON LASER DIODE EMISSION CHECK UNLEADED SOLDER : LEAD FREE MARK Installing The recorder The display window of the recorder The headphones/earphones with a remote control The display window of the remote control 3-1.DISASSEMBLY FLOW Note 1: Note 2: 3-2.BOTTOM PANEL SUB ASSY 3-3.MAIN BOARD 3-4.UPPER PANEL SUB ASSY 3-5.CONTROL ORNAMENT BLOCK 3-6.MECHANISM DECK ASSY (MT-MZNH1-181) 3-7.GEAR (BSA), GEAR (SB) 3-8.OP SERVICE ASSY 3-10.HOLDER ASSY Ver Ver Manual AdjF MENU MD1Run HM3Run OfsRun OPChk ResOK SET OK ## RMC OK ## Temp SetTmp POWER PwrAdj VC1 VBsAdj ChrgLi DESIGN LrefPw DistF 3-9.Resume Clear 3-10.Releasing The Test Mode 6-1.BLOCK DIAGRAM – MD SERVO Section – 6-2.BLOCK DIAGRAM – AUDIO Section – 4-3.BLOCK DIAGRAM – POWER SUPPLY Section – •Note For Printed Wiring Boards and Schematic Diagrams Note on Printed Wiring Board: Note on Schematic Diagram: •Waveforms IC701 1 (VI1), 2 (WI1) SCHEMATIC DIAGRAM – MAIN Section (1/9) – See page 36 for IC Block Diagrams SCHEMATIC DIAGRAM – MAIN Section (3/9) – See page 36 for IC Block Diagram SCHEMATIC DIAGRAM – MAIN Section (5/9) – SCHEMATIC DIAGRAM – MAIN Section (6/9) – Page SCHEMATIC DIAGRAM – MAIN Section (8/9) – SCHEMATIC DIAGRAM – MAIN Section (9/9) – 6-13.PRINTED WIRING BOARD – MAIN Section (1/2) – : Uses unleaded solder •Semiconductor Location Ref. No Location 6-14.PRINTED WIRING BOARD – MAIN Section (2/2) – : Uses unleaded solder Ref. No. Location CXD9811K IC401 MM1655LCBE IC501 SN761059ZQLR IC601 SC901585VAR2 IC602 R1160N121B-TR-FA IC701 SC901583EPR2 IC871 R2061K01-E2 IC891 AK6514CN-L IC901 SC901584EPR2 IC902 XC62HR5502MR •IC Pin Function Description IC801 CXD2681-222GG(SYSTEM CONTROLLER, DIGITAL SIGNAL PROCESSOR) Page Page Page Page Page Page NOTE: 7-1.PANEL SECTION MAIN SECTION 7-3.MECHANISM DECK SECTION