TDK Half Brick-iHG specifications Thermal Performance

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Thermal Performance:

	70											70
(A)	60										)	60
											(A
u rre n t	50										u rre n t	50
u tp u t C	40										u tp u t C	40
O											O
	30											30
	20											20
	30	40	50	60	70	80	90	100	110	120	130	30	40	50	60	70	80	90	100	110	120	130

Ambient Temperature (C) Ambient Temperature (C)

NC0.3m/s(60LFM)	0.5m/s(100LFM)	1.0m/s(200LFM)		NC0.3m/s(60LFM)	0.5m/s(100LFM)	1.0m/s(200LFM)
1.5m/s(300LFM)	2.0m/s(400LFM)	3.0m/s(600LFM)		1.5m/s(300LFM)	2.0m/s(400LFM)	3.0m/s(600LFM)
MaxMOSFETTemperature				MaxMOSFETTemperature
Maximumoutputcurrentvs.ambienttemperatureatn			ominal	Maximumoutputcurrentvs.ambienttemperatureatn			ominal
inputvoltageforairflowratesnaturalconvection		(0.3m/s)to		inputvoltageforairflowratesnaturalconvection		(0.3m/s)to
3.0m/swithairflowfrompin4to1.				3.0m/swithairflowfrompin1topin4.
	Thermal
	Measurement
	Location(Drain
	padofMOSFET)
Thermalmeasurementlocation–topview

Thethermalcurvesprovidedarebaseduponmeasurem		entsmadeinTDKInnoveta’sexperimentaltestsetup			thatis
describedintheThermalManagementsection.Dueto		thelargenumberofvariablesinsystemdesign,TD			KInnoveta
recommends that the user verifythemodule’s therma		l performance in the end application. Thecritical			component
shouldbethermocoupledandmonitored,andshould		notexceedthetemperaturelimitspecifiedinthed		eratingcurve
above.Itiscriticalthatthethermocouplebemoun	tedinamannerthatgivesdirectthermalcontacto		therwisesignificant
measurementerrorsmayresult.

©2008TDKInnovetaInc.	℡(877)498 0099
iHGDatasheet20080515Revision1.1	10/16