Interface Selection Guide

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Introduction

Texas Instruments (TI) provides complete interface solutions that empower you to differentiate your products and accelerate time-to-market. Our expertise in high-speed, mixed-signal circuits, system-on-a-chip integration and advanced product development processes ensures you will receive the silicon, support tools, software and technical documentation to create and deliver the best products on time and at competitive prices. Included in this selection guide you will find design considerations, technical overviews, graphic representation of portfolios, parametric tables and resource information on the following families of devices:

LVDS: (p. 4) TIA/EIA-644A specification designed for differential transmission delivering signaling rates into the Gbps range and power in the mW range with low EMI to the telecommunication and consumer markets.

xECL: (p. 4) Emitter coupled logic (xECL), high-speed differential interface technology designed for low jitter and skew.

CML: (p. 4) Current-mode logic (CML), high speed differential interface technology.

M-LVDS:(p. 8) TIA/EIA-899 specification with all the benefits of LVDS applicable to multi- point bus architecture in backplanes. Used often for clock distribution, e.g. AdvancedTCA.

Digital Isolators: (p. 10) The new ISO72x high-speed digital isolators use state-of-the-art integrated capacitive coupling and silicon- dioxide isolation barrier to provide up to

150-Mbps signaling rate with only 1-ns jitter, best-of-class noise immunity and high reliability.

RS-485/422:(p. 11) Robust TIA/EIA-485 and TIA/ EIA-422 specifications specially designed for harsh, industrial environments transmitting a differential signal up to 50 Mbps or 1.2 km.

RS-232:(p. 13) TIA/EIA-232 specification defining single-ended interface between data terminal equipment (DTE) and data circuit- terminating equipment (DCE).

UARTs: (p. 16) Universal Asynchronous Receiver/Transmitters are the key logic compo- nent of serial communication utilizing RS232, RS485/422 or LVDS transceivers to transmit or receive between remote devices performing parallel to serial conversion in the transmit process and serial to parallel conversion in the receive process.

CAN: (p. 18) Controller Area Network (ISO11898) specification commonly used in automotive and industrial applications describes differential signaling at a rate up to 1 Mbps on a 40-meter bus with multipoint topology.

FlatLink™ 3G: (p. 19) A new family of serial- izers and deserializers designed for mobile phone displays.

SerDes: (p. 20) Serializers and deserializers in the gigabit range designed to bridge large numbers of data bits over a small number of data lines in telecommunication applications.

DVI/PanelBus™: (p. 22) The Digital Visual Interface Specification, DVI, is an industry standard developed by the Digital Display Working Group (DDWG) for high-speed digital connection to digital displays. DVI uses transition-minimized DC balanced (TMDS) data signaling.

TMDS: (p. 24) Transition minimized differential signaling is the electrical interface used by DVI and HDMI.

USB Hub Controllers and Peripheral Devices: (p. 25) The USB standard was established to make connecting PCs, peripher- als and consumer electronics flexible and easy. The hub controller manages USB port connect/ disconnect activities and a peripheral controller enables USB connectivity of a peripheral device to either a host or hub.

USB Port Protection: (p. 26) Transient voltage suppressor protects USB 1.1 devices from ESD and electrical noise transients.

USB Power Managers: (p. 27) TI products, like TPS204xA and TPS205xA, are designed to meet all the USB 1.0 and 2.0 requirements for current-limiting and power switching to reliably control the power on the voltage bus.

PCI Express®: (p. 29) A robust, scalable, flexible and cost-effective I/O interconnect.

PCI Bridges: (p. 33) A peripheral component interconnect (PCI) bridge provides a high- performance connection path between either two PCI buses or a PCI component and one or more DSP devices.

CardBus Power Switches: (p. 34) The CardBus controller uses the card detect and voltage sense pins to determine a PC card’s voltage requirements and then directs the PCMCIA power switch to enable the proper voltages. Standard PC cards require that VCC be switched between ground, 3.3 V, and 5 V, while VPP is switched between ground, 3.3 V,

5 V, and 12 V. CardBay sockets have the stan- dard requirements for VCC, but require ground,

3.3V, and 5 V to VPP, and ground, 1.8 V, or 3.3

V to VCORE. Other PC card applications may simply not need 12 V or VPP while still having

the standard requirements for VCC. Therefore, consider the voltage requirements of the application when selecting a PCMCIA power switch.

1394: (p. 36) IEEE 1394 (FireWire®) high-speed interconnection enables simple, low-cost, high-bandwidth, real-time data connectivity between computers, peripherals and consumer electronics.

GTLP: (p. 39) Gunning transceiver logic plus (GTLP) derived from the JEDEC JESD8-3 GTL standard is a reduced-voltage-swing technology designed for high-speed interface between cards operating at LVTTL logic levels and backplanes operating at GTLP signal levels.

VME: (p. 41) The VMEbus™ is a standardized, 64-bit, backplane architecture that is coordi- nated and controlled by VITA. VME is used extensively in military, industrial and aerospace applications.

Clock Distribution Circuits: (p. 42)

TI offers both single-ended and differential clock buffers that perform from below 200 MHz up to 3.5 GHz in a variety of fan-out options. In addition to simple option for customers needing differential signals (LVPECL) and single-ended signals (LVTTL/LVCMOS) from the same device.

Texas Instruments 4Q 2006

Interface Selection Guide

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Texas Instruments 4Q 2006 manual Interface Selection Guide, Clock Distribution Circuits p