Intel user manual Overview, Mobile Intel 915GME Express Chipset Features

Mobile Intel® 915GME Express Chipset —Getting Started

2.0Getting Started

This chapter identifies the evaluation kit’s key components, features and specifications. It also details basic board setup and operation.

2.1Overview

The evaluation board consists of a baseboard populated with the Mobile Intel® 915GME Express Chipset , other system board components, and peripheral connectors.

Note: The evaluation board is shipped as an open system allowing for maximum flexibility in changing hardware configuration and peripherals. Since the board is not in a protective chassis, take extra precaution when handling and operating the system.

2.1.1Mobile Intel® 915GME Express Chipset Features

Features of the development kit board are summarized below:

Processor

•Supports Intel® Pentium® M Processor with 2 MByte L2 Cache on 90 nm process in the 478 pin Flip Chip Pin Grid Array (Micro-FCPGA) package

—Supported processors are the Intel® Pentium® M 760 Processor and the Intel® Pentium® M 738 Processor

•Supports Intel® Celeron® M Processor on 90 nm process in the 478 pin Flip Chip Pin Grid Array (Micro-FCPGA) package

—Supported processors are the Intel® Celeron® M 370 Processor and the Intel® Celeron® M 373 Processor

Note: This reference platform does not support the Intel® Pentium® M 745 Processor.

Mobile Intel® 915GME Express Graphics Memory Controller Hub (915GME

Express GMCH)

•1257 pin Micro-FCBGA Package

•Supports a 400/533 MHz front side bus

•Dual-Channel DDR2 at 400/533 MHz

•Two SODIMM slots (one per channel) support DDR2 SODIMMS (unbuffered, non- ECC) modules

•Supports 128 MBytes to 2 GBytes using 256 Mbit, 512 Mbit, or 1 Gbit technology

•x16 PCI Express Graphics or Serial Digital Video Out (SDVO) port

•LVDS, VGA support

I/O Controller Hub 6 (ICH6-M)

•609 pin plastic BGA package

•DMI (x4) interface with GMCH

Mobile Intel® 915GME Express Chipset
Development Kit User’s Manual	April 2007
14	Order Number: 317230-001US