Theory of
Figure 1. Mobile Intel® 915GME Express Chipset Block Diagram
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| Thermal |
| Intel® Pentium® M |
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| processor with 2MB |
| XDP |
| Clocking | |||
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| L2 cache |
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LVDS/ |
| LVDS |
| FSB |
| IMVP IV |
| Clocking | |
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ALS/BLI |
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| VR |
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| 400/533 MHz |
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| VGA |
| Mobile Intel® |
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| DDR VR | |
CRT |
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| Dual Channel DDR2 |
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| 915GME Express |
| DIMM | ||||
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| Chipset |
| 400/533 MHz |
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PCIE GFX | PCI Express / SDVO |
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| SO- | |
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| 915GME |
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| VREG |
| 3 | 4 |
7 USB Conn | USB 2.0 |
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1 Docking Conn |
| x4 DMI |
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| 5V PCI | 5V PCI | |||||
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| IDE |
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40 Pin Conn |
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| SATA Port 2 |
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| SATA Port 0 |
| Intel® 82801FBM |
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| E | USB |
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| PCI | VGA | |
Cable Connect |
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| LAN | ||||
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Direct Connect |
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| PCIE Slot 0 |
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| PCIE Slot 1 |
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Serial, IrDA/ |
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CIR |
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| 10/100 LCI |
| LAN |
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| SIO | LPC |
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2 - PS/2 |
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| Port 80h | LPC |
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Scan Matrix |
| SMC/KBC | FWH |
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AON |
| Decoder | Slot |
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3.2Mechanical Form Factor
The evaluation board conforms to the ATX form factor. For extra protection in a development environment, you may want to install the evaluation board in an ATX chassis. Internal and rear panel system I/O connectors are described in Section 3.4.3. An overview of connector and slot locations is provided in Section 4.0.
| Mobile Intel® 915GME Express Chipset |
April 2007 | Development Kit User’s Manual |
Order Number: | 21 |