Mobile Intel® 915GME Express Chipset
| 3.5 | Clock Generation | ............................................................................................... | 28 | |
| 3.6 | Power Management States | 28 | ||
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| 3.6.1 Transition to S1 or S3 | 29 | ||
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| 3.6.2 | Transition to S4 | 29 | |
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| 3.6.3 | Transition to S5 | 29 | |
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| 3.6.4 | Transition to | 29 | |
| 3.7 | Power Measurement Support | 30 | ||
4.0 | Hardware Reference | 34 | |||
| 4.1 | Primary Features | ............................................................................................... | 34 | |
| 4.2 | Back Panel Connectors | 36 | ||
| 4.3 | Configuration Settings | 37 | ||
| 4.4 | Power On and Reset Buttons | 40 | ||
| 4.5 | LEDs | ................................................................................................................ | 41 | |
| 4.6 | Other Headers | 41 | ||
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| 4.6.1 | H8 Programming Headers | 41 | |
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| 4.6.2 Expansion Slots and Sockets | 42 | ||
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| 4.6.2.1 478 Pin Grid Array | 42 | |
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| 4.6.2.2 | PCI Express (x16) | 43 |
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| 4.6.2.3 | ADD2 Slot | 45 |
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| 4.6.2.4 | PCI Express (x1) | 47 |
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| 4.6.2.5 | IDE Connector | 49 |
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| 4.6.2.6 | SATA Pinout | 49 |
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| 4.6.2.7 | Fan Connectors | 50 |
A | Heat Sink Installation Instructions | 51 |
Mobile Intel® 915GME Express Chipset |
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Development Kit User’s Manual | April 2007 |
4 | Order Number: |