Intel 915GME user manual Thermal Management, System Features and Operation, System Memory

Mobile Intel® 915GME Express Chipset —Theory of Operation

3.3Thermal Management

The objective of thermal management is to ensure that the temperature of each component is maintained within specified functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet their specified performance requirements.

Operation outside the functional limit can degrade system performance and cause reliability problems.

The development kit is shipped with a fansink thermal solution for installation on the processor. This thermal solution has been tested in an open-air environment at room temperature and is sufficient for evaluation purposes. The designer must ensure that adequate thermal management is provided for any customer-derived designs.

3.4System Features and Operation

The following sections provide a detailed view of system features and operation. Refer to Figure 2 and Table 7 for the location of the major components of the platform.

3.4.1Mobile Intel® 915GME Express Chipset

The Mobile Intel® 915GME Express Chipset features the 915GMCH and the Intel® I/O Controller Hub (ICH6-M) chipset.

The Mobile Intel® 915GME Express Chipset GMCH provides the processor interface optimized for Intel® Pentium® M Processors, system memory interface, DMI and internal graphics. It provides flexibility and scalability in graphics and memory subsystem performance. The following sections describe the reference board’s implementation of the Mobile Intel® 915GME Express Chipset GMCH features.

•1257 Micro-FCBGA package

•400/533MHz Front Side Bus

•32-bit host bus addressing

•System memory controller (DDR2 implemented)

—Supports Dual Channel and Single Channel operation

—Two 200-pin SODIMM slots

—DDR2 400/533

•Direct Media Interface (DMI)

•Integrated graphics based on Intel’s Graphics Media Accelerator 900

—Directly supports on-board VGA and LVDS interfaces.

—Supports resolutions up to 2048 x 1536 @ 85 Hz.

•SDVO interface via PCI Express x16 connector provides maximum display flexibility

—Can drive up to two display outputs

—Maximum single channel resolution of 2048 x 1536 @ 60 Hz

3.4.1.1System Memory

The evaluation board supports DDR2 400/533 main memory. Two 200-pin SODIMM connectors (one per channel) on the board support unbuffered, non-ECC, single and double-sided DDR2 400/533 MHz SODIMMs. These SODIMMs provide the ability to use up to 1 Gbit technology for a maximum of 2 GBytes system memory.

Mobile Intel® 915GME Express Chipset
Development Kit User’s Manual	April 2007
22	Order Number: 317230-001US