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| Mobile Intel® 915GME Express Chipset |
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| needed to ensure the setup time of the receiver. More precisely, | |
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| flight time is defined as: | |
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| • | The time difference between a signal at the input pin of a |
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| receiving agent crossing the switching voltage (adjusted to |
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| meet the receiver manufacturer’s conditions required for |
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| AC timing specifications; i.e., ringback, etc.) and the output |
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| pin of the driving agent crossing the switching voltage |
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| when the driver is driving a test load used to specify the |
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| driver’s AC timings. |
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| • | Maximum and Minimum Flight Time - Flight time variations |
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| are caused by many different parameters. The more |
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| obvious causes include variation of the board dielectric |
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| constant, changes in load condition, crosstalk, power noise, |
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| variation in termination resistance, and differences in I/O |
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| buffer performance as a function of temperature, voltage, |
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| and manufacturing process. Some less obvious causes |
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| include effects of Simultaneous Switching Output (SSO) |
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| and packaging effects. |
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| • | Maximum flight time is the largest acceptable flight time a |
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| network will experience under all conditions. |
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| • | Minimum flight time is the smallest acceptable flight time a |
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| network will experience under all conditions. |
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| IrDA | IrDA is an acronym for Infrared Data Association, and this | |
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| association has outlined a specification for serial communication | |
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| between two devices via a | |
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| 915GM platform has such a port and it is located on the rear of | |
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| the platform between the two USB connectors. | |
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| ISI | ||
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| transition) on the interconnect delay. For example, when a | |
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| signal is transmitted down a line and the reflections due to the | |
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| transition have not completely dissipated, the following data | |
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| transition launched onto the bus is affected. ISI is dependent | |
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| upon frequency, time delay of the line, and the reflection | |
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| coefficient at the driver and receiver. ISI may impact both timing | |
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| and signal integrity. | |
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| Network | The network is the trace of a Printed Circuit Board (PCB) that | |
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| completes an electrical connection between two or more | |
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| components. | |
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| Overshoot | The maximum voltage observed for a signal at the device pad, | |
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| measured with respect to VCC. | |
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| Pad | The electrical contact point of a semiconductor die to the | |
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| package substrate. A pad is only observable in simulations. | |
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| Pin | The contact point of a component package to the traces on a | |
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| substrate, such as the motherboard. Signal quality and timings | |
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| may be measured at the pin. | |
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| ||
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| signal) indicates that all of the system power supplies and clocks | |
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| are stable. PWRGOOD should go active a predetermined time | |
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| after system voltages are stable and should go inactive as soon | |
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| as any of these voltages fail their specifications. | |
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| Ringback | The voltage to which a signal changes after reaching its | |
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| maximum absolute value. Ringback may be caused by | |
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| reflections, driver oscillations, or other transmission line | |
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| phenomena. | |
Mobile Intel® 915GME Express Chipset |
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Development Kit User’s Manual |
| April 2007 | ||
10 |
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| Order Number: |