Chapter 1
Mainboard Specifications
CPU
•VIA C3 / EDEN EBGA Processor (onboard)
•Enhanced Ball Grid Array Package (EBGA)
•Internal L1 128KB and L2 64KB cache memory
Chipset
•VIA CLE266 North Bridge
•VT8235 South Bridge
Memory
• 1 x DDR266 DIMM socket (up to 1 GB)
Expansion Slots
• 1 x PCI
Graphics
• Integrated VIA Castlerock AGP graphics
Audio
• VT1616,
Onboard IEEE 1394 (optional)
• VIA VT6307S IEEE 1394
LAN
• VIA VT6103 10/100
IDE
• 2 X UltraDMA 66/100/133 Connectors
OnModule CardBus/CF
• RICOH 476II
LVDS (optional)
VIA VT1631 LVDS Transmitter