Cypress CY7C1992BV18 manual TAP AC Switching Characteristics, TAP Timing and Test Conditions

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CY7C1392BV18, CY7C1992BV18

CY7C1393BV18, CY7C1394BV18

TAP AC Switching Characteristics

Over the Operating Range [13, 14]

Parameter

Description

Min

Max

Unit

tTCYC

TCK Clock Cycle Time

50

 

ns

tTF

TCK Clock Frequency

 

20

MHz

tTH

TCK Clock HIGH

20

 

ns

tTL

TCK Clock LOW

20

 

ns

Setup Times

 

 

 

 

 

 

 

 

 

tTMSS

TMS Setup to TCK Clock Rise

5

 

ns

tTDIS

TDI Setup to TCK Clock Rise

5

 

ns

tCS

Capture Setup to TCK Rise

5

 

ns

Hold Times

 

 

 

 

tTMSH

TMS Hold after TCK Clock Rise

5

 

ns

tTDIH

TDI Hold after Clock Rise

5

 

ns

tCH

Capture Hold after Clock Rise

5

 

ns

Output Times

 

 

 

 

 

 

 

 

 

tTDOV

TCK Clock LOW to TDO Valid

 

10

ns

tTDOX

TCK Clock LOW to TDO Invalid

0

 

ns

TAP Timing and Test Conditions

Figure 2 shows the TAP timing and test conditions. [14]

Figure 2. TAP Timing and Test Conditions

 

 

 

0.9V

 

 

 

 

 

 

50Ω

 

 

 

 

 

 

 

 

 

 

 

 

TDO

 

 

 

 

 

 

Z0

= 50Ω

 

 

 

CL = 20 pF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ALL INPUT PULSES

1.8V

0.9V

0V

(a)GND

Test Clock

TCK

Test Mode Select

TMS

Test Data In

TDI

Test Data Out

TDO

tTH

tTMSS

tTDIS

tTL

tTCYC

tTMSH

tTDIH

tTDOV

 

 

 

t

 

 

 

 

 

 

 

 

TDOX

Notes

13.tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.

14.Test conditions are specified using the load in TAP AC Test Conditions. tR/tF = 1 ns.

Document #: 38-05623 Rev. *D

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Contents Features ConfigurationsFunctional Description Selection GuideCLK Logic Block Diagram CY7C1392BV18Doff Logic Block Diagram CY7C1393BV18 Logic Block Diagram CY7C1394BV18512K Array Gen Read Data Reg ControlPin Configuration Ball Fbga 13 x 15 x 1.4 mm PinoutCY7C1392BV18 2M x CY7C1992BV18 2M xCY7C1393BV18 1M x CY7C1394BV18 512K xPin Name Pin Description Pin DefinitionsSynchronous Read/Write Input. When Power Supply Inputs to the Core of the Device Power Supply Inputs for the Outputs of the DeviceIs Referenced with Respect to TDO for JtagFunctional Overview Application Example Shows four DDR-II SIO used in an applicationTruth Table Write Cycle DescriptionsOperation CommentsWrite cycle description table for CY7C1992BV18 follows Write cycle description table for CY7C1394BV18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram State diagram for the TAP controller followsTAP Controller Block Diagram TAP Electrical CharacteristicsTAP AC Switching Characteristics TAP Timing and Test ConditionsIdentification Register Definitions Scan Register SizesInstruction Codes Register Name Bit SizeBoundary Scan Order Bit # Bump IDPower Up Sequence Power Up Sequence in DDR-II SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Input High Voltage Vref + AC Electrical CharacteristicsInput LOW Voltage Vref Document # 38-05623 Rev. *D Capacitance Thermal ResistanceParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga UnitSwitching Characteristics Parameter Min MaxHigh LOWParameter Min Max Output Times DLL TimingSwitching Waveforms BurstOrdering Information 250 167 Package Diagram Ball Fbga 13 x 15 x 1.4 mmSYT Document HistoryNXR Sales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC SolutionsVKN/PYRS USB