Cypress CY7C1392BV18, CY7C1992BV18 manual Switching Characteristics, Parameter Min Max, High, Low

Page 23

CY7C1392BV18, CY7C1992BV18

CY7C1393BV18, CY7C1394BV18

Switching Characteristics

Over the Operating Range [20, 21]

 

Cypress

Consortium

 

 

 

 

 

Description

300 MHz

278 MHz

250 MHz

200 MHz

167 MHz

Unit

Parameter

Parameter

 

 

 

 

 

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t

POWER

 

V (Typical) to the First Access [22]

1

 

1

 

1

 

1

 

1

 

ms

 

 

DD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

tKHKH

K Clock and C Clock Cycle Time

3.3

8.4

3.4

8.4

4.0

8.4

5.0

8.4

6.0

8.4

ns

tKH

tKHKL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.32

1.4

1.6

2.0

2.4

ns

Input Clock (K/K;

 

C/C) HIGH

tKL

tKLKH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.32

1.4

1.6

2.0

2.4

ns

Input Clock (K/K;

 

C/C) LOW

tKHKH

tKHKH

K Clock Rise to

 

 

Clock Rise and C

1.49

1.6

1.8

2.2

2.7

ns

K

 

 

 

to C Rise (rising edge to rising edge)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tKHCH

tKHCH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

1.45

0

1.55

0

1.8

0

2.2

0

2.7

ns

K/K

Clock Rise to C/C Clock Rise

 

 

 

(rising edge to rising edge)

 

 

 

 

 

 

 

 

 

 

 

Setup Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tSA

tAVKH

Address Setup to K Clock Rise

0.4

0.4

0.5

0.6

0.7

ns

tSC

tIVKH

Control Setup to K Clock Rise

0.4

0.4

0.5

0.6

0.7

ns

 

 

 

(LD, R/W)

 

 

 

 

 

 

 

 

 

 

 

tSCDDR

tIVKH

Double Data Rate Control Setup to

0.3

0.3

0.35

0.4

0.5

ns

 

 

 

Clock (K/K) Rise

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(BWS0, BWS1,

BWS

2,

BWS

3)

 

 

 

 

 

 

 

 

 

 

 

tSD [23]

tDVKH

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Rise

0.3

0.3

0.35

0.4

0.5

ns

Setup to Clock (K/K)

 

 

 

 

[X:0]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tHA

tKHAX

Address Hold after K Clock Rise

0.4

0.4

0.5

0.6

0.7

ns

tHC

tKHIX

Control

Hold after K Clock Rise

0.4

0.4

0.5

0.6

0.7

ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(LD, R/W)

 

 

 

 

 

 

 

 

 

 

 

tHCDDR

tKHIX

Double Data Rate Control Hold after

0.3

0.3

0.35

0.4

0.5

ns

 

 

 

Clock (K/K) Rise

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(BWS0, BWS1,

BWS

2,

BWS

3)

 

 

 

 

 

 

 

 

 

 

 

tHD

tKHDX

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Rise

0.3

0.3

0.35

0.4

0.5

ns

Hold after Clock (K/K)

 

 

 

[X:0]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes

21.When a part with a maximum frequency above 167 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being operated and outputs data with the output timings of that frequency range.

22.This part has a voltage regulator internally; tPOWER is the time that the power must be supplied above VDD minimum initially before a read or write operation can be initiated.

23.For D2 data signal on CY7C1992BV18 device, tSD is 0.5 ns for 200 MHz, 250 MHz, 278 MHz, and 300 MHz frequencies.

Document #: 38-05623 Rev. *D

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Contents Selection Guide FeaturesConfigurations Functional DescriptionDoff Logic Block Diagram CY7C1392BV18CLK Array Gen Read Data Reg Control Logic Block Diagram CY7C1393BV18Logic Block Diagram CY7C1394BV18 512KCY7C1992BV18 2M x Pin ConfigurationBall Fbga 13 x 15 x 1.4 mm Pinout CY7C1392BV18 2M xCY7C1394BV18 512K x CY7C1393BV18 1M xSynchronous Read/Write Input. When Pin DefinitionsPin Name Pin Description TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device Is Referenced with Respect toFunctional Overview Shows four DDR-II SIO used in an application Application ExampleComments Truth TableWrite Cycle Descriptions OperationInto the device. D359 remains unaltered Write cycle description table for CY7C1992BV18 followsWrite cycle description table for CY7C1394BV18 follows DeviceIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction CodesBit # Bump ID Boundary Scan OrderDLL Constraints Power Up Sequence in DDR-II SramPower Up Sequence Maximum Ratings Electrical CharacteristicsDC Electrical Characteristics Input LOW Voltage Vref Document # 38-05623 Rev. *D AC Electrical CharacteristicsInput High Voltage Vref + Parameter Description Test Conditions Fbga Unit CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitLOW Switching CharacteristicsParameter Min Max HighDLL Timing Parameter Min Max Output TimesBurst Switching WaveformsOrdering Information 250 167 Ball Fbga 13 x 15 x 1.4 mm Package DiagramNXR Document HistorySYT USB Sales, Solutions, and Legal InformationWorldwide Sales and Design Support Products PSoC Solutions VKN/PYRS