Siemens PCIL43 Climatic Conditions, Mech. Ambient conditions, Special Features, Motherboard, Ram

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Technical data

13.1 General specifications

General technical data

 

Immunity to discharges of static electricity

± 4 kV contact discharge; (according to IEC 61000-4-2)

 

± 8 kV air discharge; (according to IEC 61000-4-2)

Immunity to RF interference

10 V/m, 80-1000 MHz and 1.4 - 2 GHz, 80% AM;

 

(according to IEC 61000-4-3)

 

10 V, 10 kHz-80 MHz; (according to IEC 61000-4-6)

Magnetic field

100 A/m, 50 Hz/60 Hz; (according to IEC 61000-4-8)

Climatic Conditions

 

Temperature

Tested to IEC 60068-2-2, IEC 60068-2-1,

 

IEC 60068-2-14

- In operation

+ 5 °C to + 40 °C without burner operation,

 

+ 5°C to + 35°C with restriction

 

CPU up to 90W power dissipation

 

See "Retrofitting instructions"

- Gradient

max. 10°C/h no condensation

- Storage/transport

– 20°C to +60°C

- Gradient

max. 20°C/h no condensation

Relative humidity

tested to IEC 60068-2-78, IEC 60068-2-30

- In operation

5% to 80% at 25 °C (no condensation)

- Gradient

max. 10°C/h no condensation

- Storage/transport

5% to 95% at 25 °C (no condensation)

- Gradient

max. 20°C/h no condensation

Mech. Ambient conditions

 

Vibration

Tested to IEC 60068-2-6, 10 cycles

- Operation 1 ,

20 - 58 Hz, Amplitude 0.015mm; 58 to 200 Hz: 2m/s2

Storage/transport

5 - 8.51 Hz, Amplitude 3.5 mm; 8.51 to 500 Hz: 9,8 m/s2

Shock resistance

tested to DIN IEC 60068-2-27

- Operation 1

half sine: 9.8 m/s2, 20 ms, 100 shocks per axis

- Storage/transport

half sine: 250 m/s2, 6 ms, 1000 shocks per axis

Special Features

 

Quality assurance

to ISO 9001

Motherboard

 

Processor

Design: LGA 775

 

Intel Pentium4 Proc. No. 551 (3.4GHz, 800 MHz FSB,

 

HT, 1 MB 2LC, EM64T)

 

Intel Celeron D Proc. No 331 (2.66GHz, 533 MHz FSB,

 

256 KB 2LC, EM64T)

Chipset

Intel 945G

RAID (onboard)

Intel ICH7R with Intel storage manager software

RAM

4 slots maximum 4 GB DDR 2 533 SDRAM

 

(PC 2 4200)

Memory expansion

256 MB, up to 4 GB (configuration refer to order

 

documents)

Expansion slots

4 PCI (max. 265 mm long)

 

2 PCIe x1

 

1 PCIe x16

13-2

SIMATIC Rack PC IL 43

Operating Instructions, Edition 09/2005, A5E00432875-01

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Contents Simatic Operating Instructions Edition 09/2005Page Industrial PC Rack PC IL Operating Instructions Edition 09/2005Safety Guidelines Table of contents 10-1 Glossary Glossary-1 Table of contents Introduction PrefaceContents format Table of Contents Guide for the operating instructionsSafety information General safety instructionsRepairs System expansionsBattery ESD guidelinesDescription OverviewAreas of application HighlightsHighlights Features General featuresFunction Optional accessories InterfacesMonitoring functions Standard versionsOptional accessories Disk drives DVD ROMOptional expansions Design External structureFront view of the device Pos Description Rear view of the device Pos DescriptionOperator controls Operator control on/off button Pos DescriptionConnecting elements InterfacesLayout of the interfaces on the rear of the device Pos Name DescriptionPower supply Position of the IEC power plug DescriptionStatus displays Status displays Display MeaningDescription 3.6 Design Deployment planning TransportUnpacking and checking the delivery unit Unpacking the deviceNoting the device identification data Device equipmentAmbient and environmental conditions Deployment planning Ambient and environmental conditions Installation Installing the devicePossible areas of installation Possible mounting methodsInstallation Installing the device Connecting Connecting peripheralsConnecting the device to power To be noted before you connect the deviceConnecting Steps for connecting the device to mainsLocalized information Secure the power plug Steps in securing the power plugBasic commissioning initial power-up CommissioningPrerequisites for commissioning Switch off the device Burner/DVD player softwareDVD burner Burner softwareRAID Software Sata interface Installation location Removable hard disksReplacing a hard disk SATA1RAID system 4MS08NVVFunctions for RAID system management Comments about faults Replace faulty drive in RAID systemSide panel Associate new hard drive Commissioning Integration EthernetFurther information Integration Temperature monitoring/display Temperature monitoringFunctions Overview of the following monitoring functionsWatchdog WD Fan monitoringFunction Expansions and configuration Open the deviceTools PreparationOpen the device Steps for opening the enclosure coverSteps for opening the device front Installing expansion cards Memory expansionMemory expansion options Installing an expansion module Installing expansion modulesSteps for installing an expansion module Installing disk drives Options of installing disk drivesInstalling and removing a disk drive or removable rack Pos DescriptionRemoving the drive carrier module Steps for removing the drive carrier moduleInstalling and removing a hard disk Disk drive or removable disk rack installationInstalling a disk drive Steps for installing a disk driveMaintenance and service Removing and installing hardware componentsRepairs Carrying out repairsReplacing the backup battery To be noted before you replace the batteryReplacing the battery Reconfiguring the Bios Setup DisposalRemoving the power supply module Removing the power supply moduleHow to remove the power supply module How to remove the motherboard Removing the motherboardRemoving the motherboard Remove filter and device fan Preparing for equipment fan exchangeRemove filter and fan StepsProcessor replacement Installing the fanHow to remove the processor Removing the processor11-7 Reinstalling the software General installation procedureRecovery CD Restore DVDInstalling Windows Booting with the CD RecoveryRestoring the factory state Setting up the partitions for Windows operating systems Setting up partitionsInstalling Microsoft Windows operating systems Format primary partitionSetting up the language selection for Windows 2000 MUI Setting up the language selection for Windows 2000 MUIInstalling drivers and software Maintenance and service Reinstalling the software Troubleshooting General problemsProblem Possible cause To correct or avoid error Problems when using modules of third-party manufacturers Technical data 13.1 General specificationsGeneral technical data SafetySpecial Features Climatic ConditionsMech. Ambient conditions MotherboardGraphics COM1Certifications Status displays LEDsPower requirements of components maximum values AC voltage supplyStandard system Output voltageTechnical data of the telescopic rails Dimensional drawings Dimensional drawing of the deviceDimensional drawing for the use of telescopic rails Dimensional drawing for the use of telescopic railsDetailed descriptions MotherboardSystem resources Bios Setup Tab Option SettingGuidelines and declarations Certificates and approvals DIN ISO 9001 certificateSoftware License Agreement Certification for the USA, Canada and AustraliaEMC Service and support Further supportTraining center Technical SupportService & Support on the Internet Figure A-1 For the temperature range 5 to 35 C Retrofitting instructionsESD Guidelines What does ESD mean?Electrical charge Figure B-1 Electrostatic voltages on an operatorAbbreviations Abbreviation Term DefinitionCGA CLKCmos COAFAQ EideEisa EMMIDE IECIgbt IrdaPata PCIPcmcia PICSata ScsiSdram SelvVRM WAVWlan WWWAbbreviations Glossary Boot diskette BootingConfiguration files Configuration softwareDevice configuration ControllerDisc-at-once DriversFormatting Gender changerHard disks HubIT networks Legacy USB supportLicense key License key diskettePassword MotherboardOperating system Packet writingReset Restore CDPixel Remove module bracketSetup Bios Setup TroubleshootingSerial interface Session at onceWindows WlanGlossary-10 Index CD-R / CD-RWIndex Index VGA Page Siemens AG