HP L25500 manual Paper-Solvent, HP Photorealistic 100, Setting Description If too low If too high

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Substrate family

Drying

Curing

Heating

Auto-

Cutter

Substrate

Input

Vacuum

 

temp.

temp.

airflow

tracking

 

-advance

tension

level

 

 

 

 

 

 

adjust.

 

 

 

 

 

 

 

 

 

 

 

Paper-Solvent

50

80

30

Yes

Yes

0

15

15

 

 

 

 

 

 

 

 

 

HP Photorealistic

50

100

30

Yes

Yes

0

15

30

 

 

 

 

 

 

 

 

 

The various settings mentioned above are described below.

Setting

Description

If too low

If too high

 

 

 

 

Drying temp.

The heat applied in the printing

Print-quality defects such as

Thermal marks may be seen on

 

zone removes water and fixes

banding, bleeding and

the substrate; they may appear

 

the image to the substrate.

coalescence may occur.

as vertical bands in some colors.

 

 

 

The substrate may wrinkle on the

 

 

 

platen, causing vertical banding,

 

 

 

ink smears or substrate jams.

Curing temp.

Curing is needed to coalesce the

 

latex, creating a polymeric film

 

which acts as a protective layer,

 

while at the same time removing

 

the remaining co-solvents from

 

the print. Curing is vital to ensure

 

the durability of the printed

 

images.

The print may emerge not fully polymerized, so that the ink smears when rubbed with a finger. The print may appear wet, after printing or later.

The substrate may wrinkle under the curing module, causing defects such as bubbles or liner detachment. The substrate wrinkles may also cause vertical banding or ink smears at the beginning of the following plot.

Handle the substrate

Heating airflow

Airflow helps to remove the

Print-quality defects such as

The printer may not reach the

 

evaporated water from the print

banding, bleeding and

expected temperature in the print

 

zone and thus allows more

coalescence may occur.

zone, causing defects such as

 

efficient drying.

 

 

banding, bleeding and

 

 

 

 

coalescence. Poor text and line

 

 

 

 

quality may be seen.

 

 

 

Auto-tracking

The substrate-advance sensor

Disable the sensor in the following cases:

 

(also known as OMAS) is located

The substrate is porous and allows ink to pass through to the

 

under the print platen; it can track

 

the substrate advance

 

platen. Clean the sensor after using this substrate.

 

automatically.

You are instructed to do so by the front panel, because the

 

 

 

 

 

sensor is dirty or unable to track this particular substrate.

 

 

 

Cutter

The printer's built-in cutter can

Disable the cutter in the following cases:

 

cut the substrate automatically

You want to use the take-up reel.

 

between each print.

 

 

You want to cut the substrate manually.

 

 

The leading edge of the substrate tends to curl and cause

 

 

 

substrate jams.

 

Substrate-advance

Your printer was calibrated at the

adjust.

factory to ensure that it advances

 

the substrate accurately when

 

using supported substrates in

 

normal environmental

 

conditions. However, you may

 

find it useful to adjust the

 

substrate advance when printing

 

on unsupported substrates or in

 

unusual but stable

 

environmental conditions.

Dark lines appear when you use up to six passes. Graininess appears when you use eight or more passes.

White lines appear when you use up to six passes. Graininess appears when you use eight or more passes.

34 Chapter 4 Handle the substrate

ENWW

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Contents HP Designjet L25500 Printer series Legal notices TrademarksTable of contents Accessories Printer specificationsIntroduction Safety precautionsGeneral safety guidelines Electrical shock hazardMechanical hazard Heat hazardFire hazard Heavy substrate hazard Ink handlingPrinters main features Label ExplanationPrinters main components Front view 60-in printerRear view 60-in printer Take-up reel motor Front panelEmbedded Web Server Support tab Setup tabMain tab Connect to a network Connectivity and software instructionsConnection method Connection type Speed Maximum cable length Other factorsTurn the printer on and off Basic setup optionsPrinter setup options Restart the printer Change the language of the front panelEmbedded Web Server setup options Change the language of the Embedded Web Server Use substrate Handle the substrateOverview Substrate family Substrate types Load a roll onto the spindleSupported substrate families Load a roll onto the spindle Handle the substrate Load a roll into the printer Substrate Change loaded substrate Handle the substrate Unload a roll from the printer Normal procedure roll attached to spindleExceptional procedure roll detached from spindle Use the take-up reel Load a roll onto the take-up reelHandle the substrate Handle the substrate Handle the substrate Enww Handle the substrate Unload a roll from the take-up reel Handle the substrate View information about the substrate Store the substrateSummary Download substrate presetsAdd a new substrate type Substrate family Select printer settings and color profileSubstrate family Description HP Photorealistic 100 Setting Description If too low If too highPaper-Solvent Substrate at the beginning Vinyl Select the number of passesKey Check the ink quantity Coalescence, grain Faster printing Color calibrationColor profiles Ink cartridges Handle the ink systemInk system components Printheads Ink funnel Printhead cleaning cartridgePrinthead cleaning container Replace an ink cartridge Ink system tipsWork with ink system components Remove an ink cartridge Work with ink system components Insert an ink cartridge Replace a printhead Remove a printhead Handle the ink system Insert a printhead Handle the ink system Handle the ink system Replace the printhead cleaning kit Remove the printhead cleaning cartridgeHandle the ink system Insert the printhead cleaning cartridge Replace the ink funnel Handle the ink system Order ink supplies CartridgePrinthead cleaner PrintheadChange margins Print optionsPrinter states Request the printers internal prints Name AccessoriesOrder accessories Minimum Maximum Printer specificationsFunctional specifications Power specifications Physical specificationsMemory specifications Ecological specificationsEnvironmental specifications Acoustic specificationsGlossary AirflowLED Order IndexMargins Enww