Cypress CY62167E MoBL Pin Configuration 2, Product Portfolio, Pin Tsop I Top View, Min, Typ Max

													CY62167E MoBL®
Pin Configuration[2, 3]
								48-Pin TSOP I Top View
					A15
						1					48	A16
					A14	2					47	BYTE
					A13	3					46	Vss
					A12	4					45	IO15/A20
					A11	5					44	IO7
					A10	6					43	IO14
					A9	7					42	IO6
					A8	8					41	IO13
					A19	9					40	IO5
					NC	10					39	IO12
					WE	11					38	IO4
					CE2	12					37	Vcc
				NC		13					36	IO11
					BHE	14					35	IO3
					BLE	15					34	IO10
					A18	16					33	IO2
					A17	17					32	IO9
					A7	18					31	IO1
					A6	19					30	IO8
					A5	20					29	IO0
					A4	21					28	OE
					A3	22					27	Vss
					A2	23					26	CE1
Product Portfolio					A1	24					25	A0
								Speed			Power Dissipation
Product		VCC Range (V)								Operating ICC (mA)
								(ns)							Standby ISB2 (∝A)
									f = 1 MHz		f = fmax
	Min			Typ[4]			Max		Typ[4]	Max	Typ[4]			Max	Typ[4]	Max
CY62167ELL	4.5		5.0				5.5	45	2.2	4.0	25		30		1.5	12

Notes

2.NC pins are not connected on the die.

3.The BYTE pin in the 48-TSOPI package must be tied to VCC to use the device as a 1M X 16 SRAM. The 48-TSOPI package can also be used as a 2M X 8 SRAM by tying the BYTE signal to VSS. In the 2M x 8 configuration, pin 45 is A20, while BHE, BLE and IO8 to IO14 pins are not used.

4.Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C.

Document #: 001-15607 Rev. *A Page 2 of 12

[+] Feedback