CY7C1338G
Document #: 38-05521 Rev. *D Page 9 of 17
Capacitance[10]
Parameter Description Test Conditions 100 TQFP
Max. 119 BGA
Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 3.3V
55pF
CCLK Clock Input Capacitance 5 5 pF
CI/O Input/Output Capacitance 5 7 pF
Thermal Resistance[10]
Parameter Description Test Conditions 100 TQFP
Package 119 BGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51.
30.32 34.1 °C/W
ΘJC Thermal Resistance
(Junction to Case) 6.85 14.0 °C/W
AC Test Loads and Waveforms
Note:
10.Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R =1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1ns ≤1ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load