Package Diagrams, Pin Tqfp 14 x 20 x 1.4 mm

CY7C1339G

Package Diagrams

100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)

16.00±0.20

14.00±0.10

1.40±0.05

100	81
1	80

22.00±0.20

20.00±0.10

0.30±0.08

0.65	12° ±1°
TYP.	(8X)

SEE DETAIL

0.20 MAX.

1.60 MAX.

R 0.08 MIN. 0.20 MAX.

0.25

0° MIN.

SEATING PLANE

STAND-OFF

0.05 MIN.NOTE:

0.15 MAX.

0.10

GAUGE PLANE

0° -7°

0.60±0.15

1.00 REF.

R 0.08 MIN. 0.20 MAX.

0.20 MIN.

DETAIL A

1.JEDEC STD REF MS-026

2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH

3.DIMENSIONS IN MILLIMETERS

51-85050-*B

Document #: 38-05520 Rev. *F

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Cypress CY7C1339G manual Package Diagrams, Pin Tqfp 14 x 20 x 1.4 mm

Contents

Features Logic Block DiagramFunctional Description1 Cypress Semiconductor Corporation Pin Configurations Selection GuideCY7C1339G 250 MHz 200 MHz 166 MHz 133 MHz Unit Pin Configurations Ball BGA Pinout Pin DefinitionsName Description Byte Write Select Inputs, active LOW. Qualified with Functional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Operation Add. Used Adsp Adsc ADV Write CLK Function Partial Truth Table for Read/Write 2BWE BW D BW C BW B BW a Operating Range Maximum RatingsAmbient Range Capacitance11 Thermal Resistance11AC Test Loads and Waveforms Tqfp BGA 250 200 166 133 Parameter Description Unit Min Max Min MaxClock Output Times Switching Waveforms Read Cycle Timing18 Write Cycle Timing18 Read/Write Cycle Timing18, 20 ZZ Mode Timing 22 DON’T Care Ordering Information Package Diagrams Pin Tqfp 14 x 20 x 1.4 mm Ball BGA 14 x 22 x 2.4 mm 90±0.05 Document History Issue Date Orig. Description of ChangeREV ECN no