Cypress CY7C1339G Capacitance11, Thermal Resistance11, AC Test Loads and Waveforms, Tqfp BGA

CY7C1339G

Electrical Characteristics Over the Operating Range[9, 10] (continued)

Parameter	Description	Test Conditions		Min.	Max.	Unit
ISB3	Automatic CE	VDD = Max, Device Deselected, or	4-ns cycle, 250 MHz		105	mA
	Power-down	VIN ≤ 0.3V or VIN > VDDQ – 0.3V
			5-ns cycle, 200 MHz		95	mA
	Current—CMOS Inputs	f = fMAX = 1/tCYC
			6-ns cycle, 166 MHz		85	mA
			7.5-ns cycle, 133 MHz		75	mA
ISB4	Automatic CE	VDD = Max, Device Deselected,	All Speeds		45	mA
	Power-down	VIN ≥ VIH or VIN ≤ VIL, f = 0
	Current—TTL Inputs

Capacitance[11]

Parameter	Description	Test Conditions	TQFP	BGA	Unit
			Package	Package
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	5	5	pF
		VDD = 3.3V.
CCLK	Clock Input Capacitance		5	5	pF
		VDDQ = 3.3V
CI/O	Input/Output Capacitance		5	7	pF
Thermal Resistance[11]

Parameter	Description	Test Conditions	TQFP	BGA	Unit
			Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard test	30.32	34.1	°C/W
	(Junction to Ambient)	methods and procedures for
		measuring thermal impedance, per
ΘJC	Thermal Resistance		6.85	14.0	°C/W
		EIA/JESD51
	(Junction to Case)

AC Test Loads and Waveforms

3.3V I/O Test Load

OUTPUT

3.3V

R = 317Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 351Ω

GND

INCLUDING

≤ 1 ns

VT = 1.5V

JIG AND

(a)

SCOPE

(c)

(b)

2.5V I/O Test Load

R = 1667Ω

OUTPUT

2.5V

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 1538Ω

GND

≤ 1 ns

VT = 1.25V

90%

10%

≤ 1 ns

90%

10%

≤ 1 ns

	INCLUDING		(c)
(a)	JIG AND	(b)
	SCOPE

Note:

11. Tested initially and after any design or process change that may affect these parameters.

Document #: 38-05520 Rev. *F Page 9 of 18

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