CY7C1354C
CY7C1356C
Document #: 38-05538 Rev. *G Page 18 of 28
Capacitance[16]
Parameter Description Test Conditions 100 TQFP
Max. 119 BGA
Max. 165 FBGA
Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V VDDQ = 2.5V 555pF
CCLK Clock Input Capacitance 5 5 5 pF
CI/O Input/Output Capacitance 5 7 7 pF
Thermal Resistance[16]
Parameter Description Test Conditions 100 TQFP
Max. 119 BGA
Max. 165 FBGA
Max. Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
29.41 34.1 16.8 °C/W
ΘJC Thermal Resistance
(Junction to Case) 6.13 14.0 3.0 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
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