Cypress CY7C1357C, CY7C1355C Capacitance15, Thermal Resistance15, AC Test Loads and Waveforms

CY7C1355C

CY7C1357C

Capacitance[15]

Parameter	Description	Test Conditions	100 TQFP	119 BGA	165 FBGA	Unit
			Max.	Max.	Max.
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	5	5	5	pF
		VDD = 3.3V.
CCLK	Clock Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CI/O	Input/Output Capacitance		5	7	7	pF
Thermal Resistance[15]

Parameter	Description	Test Conditions	100 TQFP	119 BGA	165 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	29.41	34.1	16.8	°C/W
	(Junction to Ambient)	test methods and procedures
		for measuring thermal
ΘJC	Thermal Resistance		6.31	14.0	3.0	°C/W
		impedance, per EIA/JESD51.
	(Junction to Case)

AC Test Loads and Waveforms

3.3V I/O Test Load

R = 317Ω

OUTPUT

3.3V

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 351Ω

GND

≤ 1 ns

VT = 1.5V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1 ns

2.5V I/O Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL = 50Ω

10%

90%

5 pF

R = 1538Ω

GND

INCLUDING

≤ 1 ns

VT = 1.25V

JIG AND

(a)

(b)

(c)

SCOPE

Note:

15. Tested initially and after any design or process change that may affect these parameters

90%

10%

≤ 1 ns

Document #: 38-05539 Rev. *E Page 19 of 28

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