CY7C1355C

CY7C1357C

Package Diagrams (continued)

 

 

 

 

 

 

 

 

165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BOTTOM VIEW

 

 

 

 

 

 

 

 

 

TOP VIEW

 

 

 

 

 

 

 

 

 

BOTTOM VIEWPIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TOP VIEW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.25 M C A B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

-0Ø0.06

.25 M C A B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.50

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

(165X)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+0.14

-0.06

 

1

2

3

4

5

6

7

8

9

10

11

11

10

9

8

7

6

5

Ø0.50

(165X)

4

3

2

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+0.14

 

15.00±0.10

15.00±0.10

A

1

2

3

4

5

6

7

8

9

10

11

BA

CB

DC

ED

FE

GF

H

G

15.00±0.10

 

 

J

H

 

K

J

 

 

 

LK

ML

NM

PN

RP R

14.00 15.00±0.10

1.00

7.0014.00

1.00

7.00

11

10

9

8

7

6

5

4

3

2

1A

BA

CB

DC

ED

FE

GF

HG

JH

KJ

LK

ML

NM

PN

RP

R

A

0.25 C

A

0.3600.25.3±0C .05

A

B

13.00±0.10

 

 

B

13.00±0.10

 

 

0.53±0.05

1.40 MAX.

0.15 C 1.40 MAX.

0.15 C

C

SEATING PLANE

 

 

SEATING PLANE

 

 

 

 

 

0.36

C

 

 

0.35±0.06

0.35±0.06

 

 

1.00

A

5.00

1.00

 

5.00

 

10.00

 

10.00

B

13.00±0.10

B

13.00±0.10

0.15(4X)

 

0.15(4X)

 

NOTES :

 

SOLDERNOTESPAD TYPE: : NON-SOLDER MASK DEFINED (NSMD)

PACKAGESOLDERW IGHTPAD: 0TYPE.475g: NON-SOLDER MASK DEFINED (NSMD)

JEDEC REFERENCEPACKAGE WEIGHT: MO-216: 0./475gDESIGN 4.6C

PACKAGEJEDECODEREFERENCE: BB0AC : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A

51-85180-*A

NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders

Document #: 38-05539 Rev. *E

Page 27 of 28

© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Cypress CY7C1357C, CY7C1355C manual Soldernotespad Type NON-SOLDER Mask Defined Nsmd