CY7C1470BV33
CY7C1472BV33, CY7C1474BV33
Document #: 001-15031 Rev. *C Page 17 of 30
Table 6. Identification Register Definitions
Instruction Field CY7C1470BV33
(2M x 36) CY7C1472BV33
(4M x 18) CY7C1474BV33
(1M x 72) Description
Revision Number (31:29) 000 000 000 Describes the version number
Device Depth (28:24)[12] 01011 01011 01011 Reserved for internal use
Architecture/Memory
Type(23:18) 001000 001000 001000 Defines memory type and archi-
tecture
Bus Width/Density(17:12) 100100 010100 110100 Defines width and density
Cypress JEDEC ID Code
(11:1) 00000110100 00000110100 000001 10100 Enables unique identification of
SRAM vendor
ID Register Presence
Indicator (0) 1 1 1 Indicates the presence of an ID
register
Table 7. Scan Register Sizes
Register Name Bit Size (x36) Bit Size (x18) Bit Size (x72)
Instruction 3 3 3
Bypass 1 1 1
ID 32 32 32
Boundary Scan Order – 165 FBGA 71 52 -
Boundary Scan Order – 209 FBGA - - 110
Table 8. Identification Codes
Instruction Code Description
EXTEST 000 Captures IO ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM outputs to High-Z state. This instruction is not 1149.1 compliant.
IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI
and TDO. This operation does not affect SRAM operations.
SAMPLE Z 010 Captures IO ri ng contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a High-Z state.
RESERVED 011 Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD 100 Captures IO ring contents. Places the boundary scan register between TDI and TDO.
Does not affect SRAM operation. This instruction does not implement 1149.1 preload
function and is therefore not 1149.1 compliant.
RESERVED 101 Do Not Use: This instruction is reserved for future use.
Note
12.Bit #24 is “1” in the ID Register Definitions for both 2.5V and 3.3V versions of this device.
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