Cypress CY7C1471BV33, CY7C1473BV33, CY7C1475BV33 Capacitance , Thermal Resistance

CY7C1471BV33
CY7C1473BV33, CY7C1475BV33
Document #: 001-15029 Rev. *B Page 23 of 32
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Package 165 FBGA Package 209 BGA Package Unit
CADDRESS Address Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
6 6 6 pF
CDATA Data Input Capacitance 5 5 5 pF
CCTRL Control Input Capacitance 8 8 8 pF
CCLK Clock Input Capacitance 6 6 6 pF
CI/O Input/Output Capacitance 5 5 5 pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Max 165 FBGA Max 209 FBGA Max Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test methods and procedures for
measuring thermal impedance,
according to EIA/JESD51.
24.63 16.3 15.2 °C/W
ΘJC Thermal Resistance
(Junction to Case) 2.28 2.1 1.7 °C/W
Figure 4. AC Test Loads and Waveforms
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
L
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VL= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
3.3V IO Test Load
2.5V IO Test Load
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