Identification Register Definitions | Cypress CY7C1471BV33 guide

CY7C1471BV33

CY7C1473BV33, CY7C1475BV33

Identification Register Definitions

	Instruction Field	CY7C1471BV33	CY7C1473BV33	CY7C1475BV33	Description
	Instruction Field	(2Mx36)	(4Mx18)	(1Mx72)	Description
		(2Mx36)	(4Mx18)	(1Mx72)
	Revision Number (31:29)	000	000	000	Describes the version number

	Device Depth (28:24)[12]	01011	01011	01011	Reserved for internal use
	Architecture/Memory Type(23:18)	001001	001001	001001	Defines memory type and architecture

	Bus Width/Density(17:12)	100100	010100	110100	Defines width and density

	Cypress JEDEC ID Code (11:1)	00000110100	00000110100	00000110100	Enables unique identification of SRAM
					vendor
	ID Register Presence Indicator (0)	1	1	1	Indicates the presence of an ID
					register

Scan Register Sizes

Register Name	Bit Size (x36)	Bit Size (x18)	Bit Size (x72)
Instruction	3	3	3

Bypass	1	1	1

ID	32	32	32

Boundary Scan Order – 165FBGA	71	52	-

Boundary Scan Order – 209BGA	-	-	110

Identification Codes

Instruction	Code	Description
EXTEST	000	Captures IO ring contents. Places the boundary scan register between TDI
		and TDO. Forces all SRAM outputs to High-Z state. This instruction is not
		1149.1-compliant.
IDCODE	001	Loads the ID register with the vendor ID code and places the register
		between TDI and TDO. This operation does not affect SRAM operations.
SAMPLE Z	010	Captures IO ring contents. Places the boundary scan register between TDI
		and TDO. Forces all SRAM output drivers to a High-Z state.
RESERVED	011	Do Not Use: This instruction is reserved for future use.

SAMPLE/PRELOAD	100	Captures IO ring contents. Places the boundary scan register between TDI
		and TDO. Does not affect SRAM operation. This instruction does not
		implement 1149.1 preload function and is therefore not 1149.1 compliant.
RESERVED	101	Do Not Use: This instruction is reserved for future use.

RESERVED	110	Do Not Use: This instruction is reserved for future use.

BYPASS	111	Places the bypass register between TDI and TDO. This operation does not
		affect SRAM operations.

Note

12. Bit #24 is “1” in the ID Register Definitions for both 2.5V and 3.3V versions of this device.

Document #: 001-15029 Rev. *B

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Cypress CY7C1471BV33, CY7C1475BV33 manual Identification Register Definitions, Scan Register Sizes, Identification Codes

Contents

Cypress Semiconductor Corporation 198 Champion Court FeaturesSelection Guide Functional Description Description 133 MHz 117 MHz Unit Logic Block Diagram CY7C1473BV33 4M x Logic Block Diagram CY7C1471BV33 2M x Logic Block Diagram CY7C1475BV33 1M x CY7C1471BV33 Pin Configuration CY7C1473BV33 CY7C1473BV33 4M x Ball Fbga 15 x 17 x 1.4 mm Pinout CY7C1471BV33 2M x NC/1G Ball Fbga 14 x 22 x 1.76 mm Pinout CY7C1475BV33 1M × Pin Definitions Burst Read Accesses Single Read AccessesFunctional Overview Interleaved Burst Address Table ZZ Mode Electrical CharacteristicsLinear Burst Address Table Address Operation Truth TableUsed Read/write truth table for CY7C1471BV33 follows.1, 2 Truth Table for Read/WriteFunction Ieee 1149.1 Serial Boundary Scan Jtag Disabling the Jtag FeatureTest Access Port TAP Performing a TAP Reset Overview TAP Instruction Set TEST-LOGIC Reset RUN-TEST Idle TAP Controller State Diagram Circuitry TAP Controller Block Diagram GND VIN Vddq TAP DC Electrical Characteristics and Operating Conditions3V TAP AC Test Conditions 5V TAP AC Test Conditions TAP Timing TAP AC Switching Characteristics Register Name Bit Size Identification Register DefinitionsScan Register Sizes Identification Codes Boundary Scan Exit Order 4M x Boundary Scan Exit Order 2M xBit # Ball ID Boundary Scan Exit Order 1M x Range Ambient Electrical CharacteristicsMaximum Ratings Operating Range 5V IO Test Load CapacitanceThermal Resistance Parameter Description Test Conditions Tqfp Fbga Unit Max Parameter Description 133 MHz 117 MHz Unit Min Switching CharacteristicsMin Max Read Rite Stall Switching WaveformsBW AD Address ZZ Mode Timing Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams Ball Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm VKN/AESA Issue Orig. of Change Description of Change DateDocument History VKN/KKVTMP