CY7C1471BV33
CY7C1473BV33, CY7C1475BV33
Document #: 001-15029 Rev. *B Page 19 of 32
Identification Register Definitions
Instruction Field CY7C1471BV33
(2Mx36) CY7C1473BV33
(4Mx18) CY7C1475BV33
(1Mx72) Description
Revision Number (31:29) 000 000 000 Describes the version number
Device Depth (28:24)[12] 01011 01011 01011 Reserved for internal use
Architecture/Memory Type(23:18) 001001 001001 001001 Defines memory type and architecture
Bus Width/Density(17:12) 100100 010100 110100 Defines width and density
Cypress JEDEC ID Code (11:1) 0000 0110100 00000110100 00000110100 Enables unique identification of SRAM
vendor
ID Register Presence Indicator (0) 1 1 1 Indicates the presence of an ID
register
Scan Register Sizes
Register Name Bit Size (x36) Bit Size (x18) Bit Size (x72)
Instruction 3 3 3
Bypass 1 1 1
ID 32 32 32
Boundary Scan Order – 165FBGA 71 52 -
Boundary Scan Order – 209BGA - - 110
Identification Codes
Instruction Code Description
EXTEST 000 Captures IO ring contents. Places the boundary scan register between TDI
and TDO. Forces all SRAM outputs to High-Z state. This instruction is not
1149.1-compliant.
IDCODE 001 Loads the ID register with the vendor ID code and places the register
between TDI and TDO. This operation does not affect SRAM operations.
SAMPLE Z 010 Captures IO ring contents. Places the boundary scan register between TDI
and TDO. Forces all SRAM output drivers to a High-Z state.
RESERVED 011 Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD 100 Captures IO ring contents. Places the boundary scan register between TDI
and TDO. Does not affect SRAM operation. This instruction does not
implement 1149.1 preload function and is therefore not 1149.1 compliant.
RESERVED 101 Do Not Use: This instruction is reserved for future use.
RESERVED 110 Do Not Use: This instruction is reserved for future use.
BYPASS 111 Places the bypass register between TDI and TDO. This operation does not
affect SRAM operations.
Note
12.Bit #24 is “1” in the ID Register Definitions for both 2.5V and 3.3V versions of this device.
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