CY7C1471V33
CY7C1473V33
CY7C1475V33
Document #: 38-05288 Rev. *J Page 22 of 32
Capacitance Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Package
165 FBGA
Package
209 BGA
Package Unit
CADDRESS Address Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
6 6 6 pF
CDATA Data Input Capacitance 5 5 5 pF
CCTRL Control Input Capacitance 8 8 8 pF
CCLK Clock Input Capacitance 6 6 6 pF
CIO Input/Output Capacitance 5 5 5 pF
Thermal Resistance Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Max
165 FBGA
Max
209 FBGA
Max Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Test conditions follow
standard test methods
and procedures for
measuring thermal
impedance, according to
EIA/JESD51.
24.63 16.3 15.2 °C/W
ΘJC Thermal Resistance
(Junction to Case)
2.28 2.1 1.7 °C/W
AC Test Loads and WaveformsOUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
L
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VL= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1 ns ≤1 ns
(c)
3.3V IO Test Load
2.5V IO Test Load
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