SCK (CPOL=0)

CY7C601xx, CY7C602xx

SS

TSSS

SCK (CPOL=0)

SCK (CPOL=1)

Figure 20-6. SPI Slave Timing, CPHA = 0

TSCKL

TSCKH

TSSH

MOSI Figure 20-6. SPI Slave Timing, CPHA = 0MOSI  MSB MSB

TSSU TSHD

TSDO1 21. Ordering InformationOrdering CodeFLASH SizeRAM Size

LSB

TSDO

MISO

MSB

LSB

1

21. Ordering Information

Ordering Code

FLASH Size

RAM Size

Package Type

CY7C60123-PVXC

8K

256

48-SSOP

 

 

 

 

CY7C60123-PXC

8K

256

40-PDIP

 

 

 

 

CY7C60113-PVXC

8K

256

28-SSOP

 

 

 

 

CY7C60223-PXC

8K

256

24-PDIP

 

 

 

 

CY7C60223-SXC

8K

256

24-SOIC

 

 

 

 

CY7C60223-QXC

8K

256

24-QSOP

 

 

 

 

22. Package Handling

Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may degrade device reliability.

Parameter

Description

Min

Typical

Max

Unit

TBAKETEMP

Bake Temperature

 

125

See package label

°C

TBAKETIME

Bake Time

See package label

 

72

hours

Document 38-16016 Rev. *E

Page 63 of 68

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Page 63
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Cypress CY7C602xx Ordering Information, Package Handling, SCK CPOL=0 SCK CPOL=1, Mosi Msb, 6. SPI Slave Timing, CPHA =