CY7C6431x
CY7C64345, CY7C6435x
Document Number: 001-12394 Rev *G Page 23 of 28
Package Diagram
This section illustrates the packaging specifications for the enCoRe V USB device, along with the thermal impedances for each
package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the enCoRe V emulation tools and their dimensions, refer to the development kit.
Packaging Dimensions
Figure 9. 16-Pin (3 x 3 mm) QFN
001-09116 *D
[+] Feedback