Cypress CY7C6435x, CY7C64345, CY7C6431x manual Package Diagram, Packaging Dimensions

CY7C6431x

CY7C64345, CY7C6435x

Package Diagram

This section illustrates the packaging specifications for the enCoRe V USB device, along with the thermal impedances for each package.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the enCoRe V emulation tools and their dimensions, refer to the development kit.

Packaging Dimensions

Figure 9. 16-Pin (3 x 3 mm) QFN

001-09116 *D

Document Number: 001-12394 Rev *G Page 23 of 28

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