CY7C6431x
CY7C64345, CY7C6435x
Document Number: 001-12394 Rev *G Page 25 of 28
Figure 11. 48-Pin (7 x 7 x 0.9 mm) QFN
Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade
device reliability.
Table 22.Package Handling
Parameter Description Minimum Typic al Maximum Unit
TBAKETEMP Bake Temperature 125 See package label oC
TBAKETIME Bake Time See package label 72 hours
001-13191 *C
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