Cypress CY7C6431x, CY7C64345, CY7C6435x manual Package Handling, Pin 7 x 7 x 0.9 mm QFN

CY7C6431x

CY7C64345, CY7C6435x

Figure 11. 48-Pin (7 x 7 x 0.9 mm) QFN

001-13191 *C

Package Handling

Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade device reliability.

Table 22.Package Handling

Parameter	Description	Minimum	Typical	Maximum	Unit
TBAKETEMP	Bake Temperature		125	See package label	oC
TBAKETIME	Bake Time	See package label		72	hours

Document Number: 001-12394 Rev *G Page 25 of 28

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