CY7C6431x
CY7C64345, CY7C6435x
Document Number: 001-12394 Rev *G Page 26 of 28
Thermal Impedances Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Ordering Information
Table 23. Thermal Impedances per Package
Package Typical θJA (16)
16 QFN 32.69 oC/W
32 QFN(17) 19.51 oC/W
48 QFN(17) 17.68oC/W
Table 24.Solder Reflow Peak Temperature
Package Minimum Peak Temperature(18) Maximum Peak Temperature
16 QFN 240oC260oC
32 QFN 240oC260oC
48 QFN 240oC260oC
Ordering Code Package
Information Flash SRAM No. of GPIOs Target Applications
CY7C64315-16LKXC 16-Pin QFN (3x3 mm) 16K 1K 11 Mid-tier FS USB dongle, RC-host
module
CY7C64315-16LKXCT 16-Pin QFN (Tape and Reel)
(3x3 mm) 16K 1K 11 Mid-tier FS USB dongle, RC-host
module
CY7C64316-16LKXC 16-Pin QFN (3x3 mm) 32K 2K 11 Hi-end FS USB dongle, RC-host
module
CY7C64316-16LKXCT 16-Pin QFN (Tape and Reel)
(3x3 mm) 32K 2K 11 Hi-end FS USB dongle, RC-host
module
CY7C64343-32LQXC 32-Pin QFN (3x3 mm) 8K 1K 25 F ull speed USB mouse
CY7C64343-32LQXCT 32-Pin QFN (3X3 mm) 8K 1K 25 Full speed USB mouse
CY7C64345-32LQXC 32-Pin QFN
(5x5x0.55 mm) 16K 1K 25 Full speed USB mouse
CY7C64345-32LQXCT 32-Pin QFN (Tape and Reel)
(5x5x0.55 mm) 16K 1K 25 Full speed USB mouse
CY7C64355-48LTXC 48-Pin QFN
(7x7x0.9 mm) 16K 1K 36 Full speed USB keyboard
CY7C64355-48LTXCT 48-Pin QFN (Tape and Reel)
(7x7x0.9 mm) 16K 1K 36 Full speed USB keyboard
CY7C64356-48LTXC 48-Pin QFN
(7x7x0.9 mm) 32K 2K 36 Hi-end FS USB keyboard
CY7C64356-48LTXCT 48-Pin QFN (Tape and Reel)
(7x7x0.9 mm) 32K 2K 36 Hi-end FS USB keyboard
Notes
16.TJ = TA + Power x θJA.
17.To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.
18.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
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