Cypress CY7C6435x manual Thermal Impedances, Solder Reflow Peak Temperature, Ordering Information

CY7C6431x

CY7C64345, CY7C6435x

Thermal Impedances

Table 23. Thermal Impedances per Package

Package	Typical θJA (16)
16 QFN	32.69 oC/W
32 QFN(17)	19.51 oC/W
48 QFN(17)	17.68oC/W

Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Table 24.Solder Reflow Peak Temperature

Package	Minimum Peak Temperature(18)	Maximum Peak Temperature
16 QFN	240oC	260oC
32 QFN	240oC	260oC
48 QFN	240oC	260oC

Ordering Information

Ordering Code	Package	Flash	SRAM	No. of GPIOs	Target Applications
	Information
CY7C64315-16LKXC	16-Pin QFN (3x3 mm)	16K	1K	11	Mid-tier FS USB dongle, RC-host
					module
CY7C64315-16LKXCT	16-Pin QFN (Tape and Reel)	16K	1K	11	Mid-tier FS USB dongle, RC-host
	(3x3 mm)				module
CY7C64316-16LKXC	16-Pin QFN (3x3 mm)	32K	2K	11	Hi-end FS USB dongle, RC-host
					module
CY7C64316-16LKXCT	16-Pin QFN (Tape and Reel)	32K	2K	11	Hi-end FS USB dongle, RC-host
	(3x3 mm)				module
CY7C64343-32LQXC	32-Pin QFN (3x3 mm)	8K	1K	25	Full speed USB mouse
CY7C64343-32LQXCT	32-Pin QFN (3X3 mm)	8K	1K	25	Full speed USB mouse
CY7C64345-32LQXC	32-Pin QFN	16K	1K	25	Full speed USB mouse
	(5x5x0.55 mm)
CY7C64345-32LQXCT	32-Pin QFN (Tape and Reel)	16K	1K	25	Full speed USB mouse
	(5x5x0.55 mm)
CY7C64355-48LTXC	48-Pin QFN	16K	1K	36	Full speed USB keyboard
	(7x7x0.9 mm)
CY7C64355-48LTXCT	48-Pin QFN (Tape and Reel)	16K	1K	36	Full speed USB keyboard
	(7x7x0.9 mm)
CY7C64356-48LTXC	48-Pin QFN	32K	2K	36	Hi-end FS USB keyboard
	(7x7x0.9 mm)
CY7C64356-48LTXCT	48-Pin QFN (Tape and Reel)	32K	2K	36	Hi-end FS USB keyboard
	(7x7x0.9 mm)

Notes

16.TJ = TA + Power x θJA.

17.To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.

18.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.

Document Number: 001-12394 Rev *G Page 26 of 28

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