CY8C21634, CY8C21534
CY8C21434, CY8C21334, CY8C21234
Document Number: 38-12025 Rev. *O Page 38 of 45
Figure 28. 56-Pin (300-Mil) SSOP
Thermal Impedances
51-85062 *C
Table 40. Thermal Impedances per Package
Package Typic al θJA [22] Typical θJC
16 SOIC 123 oC/W 55 oC/W
20 SSOP 117 oC/W 41 oC/W
28 SSOP 96 oC/W 39 oC/W
32 QFN[23] 5x5 mm 0.60 MAX 27 oC/W 15 oC/W
32 QFN[23] 5x5 mm 0.93 MAX 22 oC/W 12 oC/W
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