Cypress CY8C21534, CY8C21334, CY8C21634, CY8C21234, CY8C21434 manual Document History

CY8C21634, CY8C21534

CY8C21434, CY8C21334, CY8C21234

Document History Page

Document Title: CY8C21234/CY8C21334/CY8C21434/CY8C21534/CY8C21634 PSoC® Programmable System-on-Chip™

Document Number: 38-12025

Revision	ECN No.	Orig. of	Submission	Description of Change
		Change	Date
**	227340	HMT	See ECN	New silicon and document (Revision **).
*A	235992	SFV	See ECN	Updated Overview and Electrical Spec. chapters, along with revisions to the
				24-pin pinout part. Revised the register mapping tables. Added a SSOP
				28-pin part.
*B	248572	SFV	See ECN	Changed title to include all part #s. Changed 28-pin SSOP from CY8C21434
				to CY8C21534. Changed pin 9 on the 28-pin SSOP from SMP pin to Vss pin.
				Added SMP block to architecture diagram. Update Electrical Specifications.
				Added another 32-pin MLF part: CY8C21634.
*C	277832	HMT	See ECN	Verify data sheet standards from SFV memo. Add Analog Input Mux to appli-
				cable pin outs. Update PSoC Characteristics table. Update diagrams and
				specs. Final.
*D	285293	HMT	See ECN	Update 2.7V DC GPIO spec. Add Reflow Peak Temp. table.
*E	301739	HMT	See ECN	DC Chip-Level Specification changes. Update links to new CY.com Portal.
*F	329104	HMT	See ECN	Re-add pinout ISSP notation. Fix TMP register names. Clarify ADC feature.
				Update Electrical Specifications. Update Reflow Peak Temp. table. Add 32
				MLF E-PAD dimensions. Add ThetaJC to Thermal Impedance table. Fix
				20-pin package order number. Add CY logo. Update CY copyright.
*G	352736	HMT	See ECN	Add new color and logo. Add URL to preferred dimensions for mounting MLF
				packages. Update Transmitter and Receiver AC Digital Block Electrical
				Specifications.
*H	390152	HMT	See ECN	Clarify MLF thermal pad connection info. Replace 16-pin 300-MIL SOIC with
				correct 150-MIL.
*I	413404	HMT	See ECN	Update 32-pin QFN E-Pad dimensions and rev. *A. Update CY branding and
				QFN convention.
*J	430185	HMT	See ECN	Add new 32-pin 5x5 mm 0.60 thickness QFN package and diagram,
				CY8C21434-24LKXI. Update thermal resistance data. Add 56-pin SSOP
				on-chip debug non-production part, CY8C21001-24PVXI. Update typical and
				recommended Storage Temperature per industrial specs. Update copyright
				and trademarks.
*K	677717	HMT	See ECN	Add CapSense SNR requirement reference. Add new Dev. Tool section. Add
				CY8C20x34 to PSoC Device Characteristics table. Add Low Power
				Comparator (LPC) AC/DC electrical spec. tables. Update rev. of 32-Lead (5x5
				mm 0.60 MAX) QFN package diagram.
*L	2147847	UVS/PYRS	02/27/08	Added 32-Pin QFN Sawn pin diagram, package diagram, and ordering infor-
				mation.
*M	2273246	UVS/AESA	04/01/08	Added 32 pin thin sawn package diagram.
*N	2618124	OGNE/PYRS	12/09/08	Added Note in Ordering Information section.
				Changed title from PSoC Mixed-Signal Array to PSoC
				Programmable System-on-Chip
*O	2684145	SNV/AESA	04/06/2009	Updated 32-Pin Sawn QFN package dimension for CY8C21434-24LTXIT
				Updated Getting Started, Development Tools, and Designing with PSoC
				Designer Sections

Document Number: 38-12025 Rev. *O Page 44 of 45

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