CY8C21634, CY8C21534
CY8C21434, CY8C21334, CY8C21234
Document Number: 38-12025 Rev. *O Page 44 of 45
Document History Page
Document Title: CY8C21234/CY8C21334/CY8C21434/CY8C21534/CY8C21634 PSoC® Programmable System-on-Chip™
Document Number: 38-12025
Revision ECN No. Orig. of
Change
Submission
Date Description of Change
** 227340 HMT See ECN New silicon and document (Revision **).
*A 235992 SFV See ECN Updated Overview and Electrical Spec. chapters, along with revisions to the
24-pin pinout part. Revised the register mapping tables. Added a SSOP
28-pin part.
*B 248572 SFV See ECN Changed title to include all part #s. Changed 28-pin SSOP from CY8C21434
to CY8C21534. Changed pin 9 on the 28-pin SSOP from SMP pin to Vss pin.
Added SMP block to architecture diagram. Update Electrical Specifications.
Added another 32-pin MLF part: CY8C21634.
*C 277832 HMT See ECN Verify data sheet standards from SFV memo. Add Analog Input Mux to appli-
cable pin outs. Update PSoC Characteristics table. Update diagrams and
specs. Final.
*D 285293 HMT See ECN Update 2.7V DC GPIO spec. Add Reflow Peak Temp. table.
*E 301739 HMT See ECN DC Chip-Level Specification changes. Update links to new CY.com Portal.
*F 329104 HMT See ECN Re-add pinout ISSP notation. Fix TMP register names. Clarify ADC feature.
Update Electrical Specifications. Update Reflow Peak Temp. table. Add 32
MLF E-PAD dimensions. Add ThetaJC to Thermal Impedance table. Fix
20-pin package order number. Add CY logo. Update CY copyright.
*G 352736 HMT See ECN Add new color and logo. Add URL to preferred dimensions for mounting MLF
packages. Update Transmitter and Receiver AC Digital Block Electrical
Specifications.
*H 390152 HMT See ECN Clarify MLF thermal pad connection info. Replace 16-pin 300-MIL SOIC with
correct 150-MIL.
*I 413404 HMT See ECN Update 32-pin QFN E-Pad dimensions and rev. *A. Update CY branding and
QFN convention.
*J 430185 HMT See ECN Add new 32-pin 5x5 mm 0.60 thickness QFN package and diagram,
CY8C21434-24LKXI. Update thermal resistance data. Add 56-pin SSOP
on-chip debug non-production part, CY8C21001-24PVXI. Update typical and
recommended Storage Temperature per industrial specs. Update copyright
and trademarks.
*K 677717 HMT See ECN Add CapSense SNR requirement reference. Add new Dev. Tool section. Add
CY8C20x34 to PSoC Device Characteristics table. Add Low Power
Comparator (LPC) AC/DC electrical spec. tables. Update rev. of 32-Lead (5x5
mm 0.60 MAX) QFN package diagram.
*L 2147847 UVS/PYRS 02/27/08 Added 32-Pin QFN Sawn pin diagram, package diagram, and ordering infor-
mation.
*M 2273246 UVS/AESA 04/01/08 A dded 32 pin thin sawn package diagram.
*N 2618124 OGNE/PYRS 12/09/08 Added Note in Ordering Information section.
Changed title from PSoC Mixed-Signal Array to PSoC
Programmable System-on-Chip
*O 2684145 SNV/AESA 04/06/2009 Updated 32-Pin Sawn QFN package dimension for CY8C21434-24LTXIT
Updated Getting Started, Development Tools, and Designing with PSoC
Designer Sections
[+] Feedback