VCAP A16 A14
A12
A7
A6
A5
INT
A4
NC
NC
NC
VSS
NC
VRTCbat
DQ 0
A3
A2
A1
A0
DQ 1
DQ 2
X1
X2
148 V CC
247 A15
346 HSB
445 W
544 A13
643 A8
742 A9
841 NC
940 A11
10 | (TOP) | 39 |
| NC |
11 | 38 |
| NC | |
| ||||
| ||||
12 |
| 37 |
| NC |
|
| |||
|
| |||
13 |
| 36 |
| V SS |
|
| |||
|
|
1435 NC
1534 V RTCcap
1633 DQ 6
1732 G
1831 A10
1930 E
2029 DQ 7
2128 DQ 5
2227 DQ 4
2326 DQ 3
2425 V CC
Pin Descriptions
Pin Name | IO Type |
|
| Description |
| Input | Address: The 17 address inputs select one of 131,072 bytes in the nvSRAM array or one of 16 bytes | ||
|
| in the clock register map | ||
I/O | Data: | |||
E | Input | Chip Enable: The active low |
| input selects the device |
E |
WInput Write Enable: The active low W enables data on the DQ pins to be written to the address location selected on the falling edge of E
GInput Output Enable: The active low G input enables the data output buffers during read cycles.
X1 | Output | Crystal Connection, drives crystal on startup | |
X2 | Input | Crystal Connection for 32.768 kHz crystal | |
VRTCcap | Power Supply | Capacitor supplied backup RTC supply voltage (Left unconnected if VRTCbat is used) | |
VRTCbat | Power Supply | Battery supplied backup RTC supply voltage (Left unconnected if VRTCcap is used) | |
VCC | Power Supply | Power: 3.0V, +20%, | |
HSB | I/O |
| : When low this output indicates a Store is in progress. When pulled low external |
Hardware Store Busy | |||
|
| to the chip, it will initiate a nonvolatile STORE operation. A weak pull up resistor keeps this pin high if | |
|
| not connected. (Connection Optional). | |
INT | Output | Interrupt Control: Can be programmed to respond to the clock alarm, the watchdog timer and the | |
|
| power monitor. Programmable to either active high (push/pull) or active low | |
VCAP | Power Supply | Autostore™ Capacitor: Supplies power to nvSRAM during power loss to store data from SRAM to | |
|
| nonvolatile storage elements. | |
VSS | Power Supply | Ground | |
NC | No Connect | Unlabeled pins have no internal connections. |
Note
1. For detailed package size specifications, See “Package Diagrams” on page 22..
Document #: | Page 2 of 23 |
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