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Introduction |
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Overview
Pentium II
The Pentium® II Processor is the
A significant feature of the Pentium® II Processor, from a system perspective, is the
The Pentium® II Processor utilizes Single Edge Contact (S.E.C.) (Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2 cache to remain tightly coupled to the processor, while maintaining flexibility when implementing high performance processors into OEM systems. The second level cache is performance optimized and tested at the cartridge level. The S.E.C. cartridge utilizes surface mounted core components and a printed circuit board with an edge finger connec- tion. The S.E.C. cartridge package introduced on the Pentium® II Processor will also be used in future Slot 1 processors.
The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB with an edge finger connection. The thermal plate allows standardized heatsink attachment or customized thermal solutions. The thermal plate enables a reusable heatsink to minimize fit issues for serviceability, upgradeability and replacement. The full enclosure also protects the surface mount components. The edge finger connection maintains socketabilty for system configuration. The edge finger con- nector is denoted as ‘Slot 1 connector’in this and other documentation.
The entire enclosed product is called the Pentium® II Processor. The packaging technology and each of the physical elements of the product are referred to using accurate technical descriptions. This allows clear reference to the products as just a
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