5.Remove the heat sink (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits.
●Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●Thermal paste is used on the VGA chip (3) and the heat sink section (4) that services it
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