3.Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and the system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the processor each time the fan/heat sink assembly is removed. Replacement thermal material is included with the fan/heat sink assembly and system board spare part kits. Thermal paste is used on the processor (1) and the section of the fan/heat sink assembly (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.
56 | Chapter 4 Removal and replacement procedures |