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Intel
LGA 771
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Assembled Component and Package Description
Models:
LGA 771
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Assembled Component and Package Description
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LGA 771 Socket Mechanical Design Guide
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Contents
LGA771 Socket
Mechanical Design Guide
LGA 771 Socket Mechanical Design Guide
Contents
Figures
Tables
Revision History
Revision Description Date
LGA 771 Socket Mechanical Design Guide
Introduction
Document Goals and Scope
Term Description
Terminology
Reference Documents
Document Intel Order Number
Assembled Component and Package Description
Assembled Component and Package Description
Attachment
Mechanical Requirements
Socket Components
Package Installation / Removal Access
Name
Contacts
Lot Traceability
Socket Weight
Socket Size
Package/Socket Stackup Height
Socket Loading Specifications
Intel Xeon 5000 Sequence Package and Socket Stackup Height
Parameter Board
Socket Loading Specifications
Min Max Unit Thickness
Definition of R
Mechanical Requirements
LGA771 Socket Electrical Requirements
Electrical Requirements
Criteria Size
Electrical Requirements
Environmental Requirements
Detailed description of this methodology can be found at
Use Conditions Environment
Shipping and Handling
Solvent Resistance
Durability
Environmental Requirements
Mechanical Drawings
Drawing Description Number
Figure A-1. LGA Socket Assembly Drawing Sheet 1
Figure A-2. LGA Socket Assembly Drawing Sheet 2
Figure A-3. LGA Socket Assembly Drawing Sheet 3
Figure A-4. LGA Socket Assembly Drawing Sheet 4
Figure A-5. LGA771 Socket Motherboard Footprint Sheet 1
Figure A-6. LGA771 Socket Motherboard Footprint Sheet 2
Figure A-7. LGA771 Socket Motherboard Footprint Sheet 3
Figure A-8. LGA771 Socket Motherboard Footprint Sheet 4
Figure A-9. LGA771 Socket Motherboard Footprint Sheet 5
Figure A-10. LGA771 Socket Motherboard Footprint Sheet 6
Figure A-11. LGA 771 Socket Motherboard Footprint Sheet 7
Figure A-12. LGA 771 Socket Footprint Sheet 1
Figure A-13. LGA 771 Socket Footprint Sheet 2
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