Intel LGA 771 manual Assembled Component and Package Description

Assembled Component and Package Description

2Assembled Component and Package Description

The LGA771 Socket dimensions and characteristics must be compatible with that of the processor package and related assembly components. Processors using Flip-Chip Land Grid Array package technology are targeted to be used with the LGA771 socket.

The assembled component may consist of a cooling solution (heatsink, fan, clips, and retention mechanism), and processor package. The processor Thermal/Mechanical Design Guidelines (TMDG) provides information for designing components compliant with the Intel reference design.

Relevant processor 771-Land LGA package and pin-out information is given in the processor datasheet.

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LGA 771 Socket Mechanical Design Guide 9