Intel LGA 771 2

LGA 771 Socket Mechanical Design Guide 9

Assembled Component and Package Description

2Assembled Component and

Package Description

The LGA771 Socket dimensions and characteristics must be compatible with that of the

processor package and related assembly components. Processors using Flip-Chip Land

Grid Array package technology are targeted to be used with the LGA771 socket.

The assembled component may consist of a cooling solution (heatsink, fan, clips, and

retention mechanism), and processor package. The processor Thermal/Mechanical

Design Guidelines (TMDG) provides information for designing components compliant

with the Intel reference design.

Relevant processor 771-Land LGA package and pin-out information is given in the

processor datasheet.

Contents

Main Page Contents Figures Tables Revision History Page 1 1.1 Document Goals and Scope 1.1.1 LGA771 Socket Overview 1.1.2 Document Goals 1.1.3 Important Remarks 1.2 Terminology 1.3 Reference Documents 2 Package Description Page 3 3.1 Attachment 3.2 Socket Components 3.2.1 Socket Body 3.2.1.1 Housing LGA771 LF-LGA771 Manufacturers insignia 3.2.1.5 Contacts 3.2.1.6 Solder Balls 3.2.2 Socket Actuation Mechanism 3.2.3 Pick and Place Cover 3.2.4 Socket Insertion / Actuation Forces 3.3 Socket Size 3.4 Socket Weight 3.5 Package/Socket Stackup Height 3.6 Socket Loading Specifications Table 3-2. Socket Loading Specifications Page Page 4 Table 4-1. LGA771 Socket Electrical Requirements Page 5 Table 5-1. Use Conditions Environment Page Page A Mechanical Drawings