LGA 771 Socket Mechanical Design Guide 9
Assembled Component and Package Description
2Assembled Component and

Package Description

The LGA771 Socket dimensions and characteristics must be compatible with that of the
processor package and related assembly components. Processors using Flip-Chip Land
Grid Array package technology are targeted to be used with the LGA771 socket.
The assembled component may consist of a cooling solution (heatsink, fan, clips, and
retention mechanism), and processor package. The processor Thermal/Mechanical
Design Guidelines (TMDG) provides information for designing components compliant
with the Intel reference design.
Relevant processor 771-Land LGA package and pin-out information is given in the
processor datasheet.
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