Electrical Requirements

4Electrical Requirements

Table 4-1provides the LGA771 Socket electrical requirements.

Socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

Table 4-1.

LGA771 Socket Electrical Requirements

 

 

 

 

 

 

No

Criteria

Size

Notes

 

 

 

 

 

 

*1

Mated loop

1.17 mm:

The inductance calculated for two contacts, considering one

 

 

inductance, Loop

<3.9 nH

forward conductor and one return conductor. These values

 

 

 

 

must be satisfied at the worst-case height of the socket.

 

 

 

 

 

 

2

Mated partial mutual

NA

The inductance on a conductor due to any single neighboring

 

 

inductance, L

 

conductor.

 

 

 

 

 

 

3

Maximum mutual

<1 pF

The capacitance between two pins/connectors.

 

 

capacitance, C

 

 

 

 

 

 

 

 

4

Socket Average

15.2 mΩ

This value has to be satisfied at all times.

 

 

Contact Resistance

 

The specification listed is at room temperature.

 

 

(EOL)

 

 

 

 

 

 

The socket average resistance target is derived from average

 

 

 

 

of every chain contact resistance, with a chain contact

 

 

 

 

resistance defined as the resistance of each chain minus

 

 

 

 

resistance of shorting bars divided by number of lands in the

 

 

 

 

daisy chain.

 

 

 

 

Socket Contact Resistance: The resistance of the socket

 

 

 

 

contact, including the interface resistance to the package land.

 

 

 

 

 

 

5

Max Chain Contact

28 mΩ

This value has to be satisfied at all times.

 

 

Resistance (EOL)

 

The specification listed is at room temperature.

 

 

 

 

The socket average resistance target is derived from average

 

 

 

 

of every chain contact resistance, with a chain contact

 

 

 

 

resistance defined as the resistance of each chain minus

 

 

 

 

resistance of shorting bars divided by number of lands in the

 

 

 

 

daisy chain.

 

 

 

 

Socket Contact Resistance: The resistance of the socket

 

 

 

 

contact, including the interface resistance to the package land.

 

 

 

 

 

 

6

Bulk Resistance

3 mΩ

The bulk resistance increase per contact from 24°C to 100°C

 

 

Increase

 

 

 

 

 

 

 

 

7

Dielectric Withstand

360 Volts

 

 

 

Voltage

RMS

 

 

 

 

 

 

 

8

Insulation Resistance

800 MΩ

 

 

 

 

 

 

§

LGA 771 Socket Mechanical Design Guide

19

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Image 19
Intel LGA 771 manual LGA771 Socket Electrical Requirements, Criteria Size