Intel LGA 771 - page 23

LGA 771 Socket Mechanical Design Guide 23

Environmental Requirements

5.1 Solvent Resistance

Requirement: No damage to ink markings if applicable. EIA 364-11A.

5.2 Durability

Use per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and

30th cycles. The package should be removed at the end of each de-actuation cycle and

reinserted into the socket. The socket’s pick-and-place cover must be able to be

inserted and removed from the socket at least 30 times.

Contents

Main Page Contents Figures Tables Revision History Page 1 1.1 Document Goals and Scope 1.1.1 LGA771 Socket Overview 1.1.2 Document Goals 1.1.3 Important Remarks 1.2 Terminology 1.3 Reference Documents 2 Package Description Page 3 3.1 Attachment 3.2 Socket Components 3.2.1 Socket Body 3.2.1.1 Housing LGA771 LF-LGA771 Manufacturers insignia 3.2.1.5 Contacts 3.2.1.6 Solder Balls 3.2.2 Socket Actuation Mechanism 3.2.3 Pick and Place Cover 3.2.4 Socket Insertion / Actuation Forces 3.3 Socket Size 3.4 Socket Weight 3.5 Package/Socket Stackup Height 3.6 Socket Loading Specifications Table 3-2. Socket Loading Specifications Page Page 4 Table 4-1. LGA771 Socket Electrical Requirements Page 5 Table 5-1. Use Conditions Environment Page Page A Mechanical Drawings