Intel LGA 771 LGA771, LF-LGA771, Manufacturers insignia

Mechanical Requirements

12 LGA 771 Socket Mechanical Design Guide

operating temperature, while mounted on an FR4-type motherboard material. The

creep properties of the material must be such that the mechanical integrity of the

socket is maintained for the use condition outlined in Section 5.

The color of the socket housing will be dark as compared to the solder balls to provide

the contrast needed for surface-mount (SMT) equipment pick and place vision systems.

Components of the socket may be different colors as long as they meet the above

requirement.

Access will be provided to facilitate the manual insertion and removal of the package.

To assist in package alignment and proper orientation during package installation into

the socket:

• The package substrate has keying notches along two opposing edges of the

package and offset from the package centerline (refer to the processor datasheet

for further details).

• The socket utilizes one feature designed to mate with the keying notch along the

inside wall of the package seating cavity (refer to Appendix A).

Standoffs will be provided on the bottom of the socket base in order to ensure the

minimum socket height after solder reflow. The standoff locations and surface area

located as specified in Appendix A. A minimum gap between the solder ball seating

plane and the standoff prior to reflow is required to prevent solder ball to motherboard

land open joints.

All markings withstand a temperature of 260°C for 40 seconds, which is typical of a

reflow/rework profile for solder material used on the socket, as well as any

environmental test procedure outlined in Section 5 without degrading.

3.2.1.4.1 Name

LGA771 (Font type is Helvetica Bold – minimum 6 point (or 2.125 mm)).

This mark shall be stamped or Laser Marked into the sidewall of the stiffener plate on

the actuation lever side when eutectic solder is used.

LF-LGA771 (Font type is Helvetica Bold – minimum 6 point (or 2.125 mm)).

This mark shall be stamped or Laser Marked into the sidewall of the stiffener plate on

the actuation lever side when lead-free solder is used.

Manufacturer’s insignia (Font size is at supplier’s discretion).

This mark will be molded or Laser Marked into the socket housing.

Both socket name and manufacturer’s insignia will be visible when first seated on the

motherboard.