Mechanical Requirements
operating temperature, while mounted on an
The color of the socket housing will be dark as compared to the solder balls to provide the contrast needed for
3.2.1.2Package Installation / Removal Access
Access will be provided to facilitate the manual insertion and removal of the package.
To assist in package alignment and proper orientation during package installation into the socket:
•The package substrate has keying notches along two opposing edges of the package and offset from the package centerline (refer to the processor datasheet for further details).
•The socket utilizes one feature designed to mate with the keying notch along the inside wall of the package seating cavity (refer to Appendix A).
3.2.1.3Socket Standoffs
Standoffs will be provided on the bottom of the socket base in order to ensure the minimum socket height after solder reflow. The standoff locations and surface area located as specified in Appendix A. A minimum gap between the solder ball seating plane and the standoff prior to reflow is required to prevent solder ball to motherboard land open joints.
3.2.1.4Markings
All markings withstand a temperature of 260°C for 40 seconds, which is typical of a reflow/rework profile for solder material used on the socket, as well as any environmental test procedure outlined in Section 5 without degrading.
3.2.1.4.1Name
LGA771 (Font type is Helvetica Bold – minimum 6 point (or 2.125 mm)).
This mark shall be stamped or Laser Marked into the sidewall of the stiffener plate on the actuation lever side when eutectic solder is used.
This mark shall be stamped or Laser Marked into the sidewall of the stiffener plate on the actuation lever side when
Manufacturer’s insignia (Font size is at supplier’s discretion). This mark will be molded or Laser Marked into the socket housing.
Both socket name and manufacturer’s insignia will be visible when first seated on the motherboard.
12 | LGA 771 Socket Mechanical Design Guide |
