Terminology, Reference Documents, Term Description

Introduction

1.2Terminology

Term	Description

LGA771 Socket	Processor in the 771-land package mates with the system board through a surface
	mount, 771-pin, LGA (land grid array) socket.

LGA771-Land	Processors in the 771-Land package are available in a Flip-Chip Land Grid Array
LGA771 Package	package technology, consisting of a processor core mounted on a substrate with an
	integrated heat spreader (IHS). This packaging technology employs a 1.09 mm x
	1.17 mm pitch for the substrate lands. Refer to the processor datasheet for
	additional information.

IHS (Integrated Heat	A component of the processor package used to enhance the thermal performance of
Spreader)	the package. Component thermal solutions interface with the processor at the IHS
	surface.

Lead-free / Pb-free	Lead has not been intentionally added, but lead may still exist as an impurity below
	1000 ppm.

RoHS compliant	Lead and other materials banned in RoHS Directive are either (1) below all applicable
	substance thresholds as proposed by the EU or (2) an approved/pending exemption
	applies. (Note: RoHS implementing details are not fully defined and may change).

Document		Intel Order Number

Dual-Core Intel® Xeon® Processor 5000	Series Datasheet	313079

Dual-Core Intel® Xeon® Processor 5100	Series Datasheet	313355

Dual-Core Intel® Xeon® Processor 5000	Series Thermal/Mechanical Design Guide	313062

Dual-Core Intel® Xeon® Processor 5100	Series Thermal/Mechanical Design Guide	313357

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet		315569

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guide		315794

Note: Contact your Intel representative for the latest revisions of these documents.

8	LGA 771 Socket Mechanical Design Guide